BUY HB541 https://www.utsource.net/itm/p/1385455.html

The HB541 is a TSOP-20 package from Texas Instruments. It is a 20-pin thin small outline package (TSOP) designed for surface mount applications. It is used to package a variety of integrated circuits, including microcontrollers, memory chips, and other logic devices. The HB541 is a low-profile package with a maximum height of 1.2mm. It has a lead pitch of 0.5mm, and a lead width of 0.3mm. The package has a lead-free finish, and is RoHS compliant. The HB541 is suitable for a wide range of applications, including automotive, consumer, and industrial applications. It is designed to provide excellent electrical performance, and is suitable for high-speed applications. It is also suitable for use in high-temperature environments. (For reference only)