Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the specified range of 2.0V to 5.5V.
   • Connect the ground (GND) pin to a stable reference ground.

2. Input Signals:

   • Input signals should be within the valid logic levels:
     • High level (V_IH): 2.0V to V_CC
     • Low level (V_IL): 0V to 0.8V

3. Output Signals:

   • The output high level (V_OH) will be V_CC - 0.4V at a load current of 0.1mA.
   • The output low level (V_OL) will be 0.4V or less at a load current of 8mA.

4. Propagation Delay:

   • The propagation delay time (t_pd) is typically 15ns at V_CC = 5V and ambient temperature (TA) = 25°C.

5. Thermal Management:

   • Ensure that the power dissipation (P_D) does not exceed 100mW to avoid overheating.
   • Consider using heat sinks or other cooling methods if operating near the maximum power dissipation.

6. Operating Temperature:

   • The device is rated for operation over the industrial temperature range from -40°C to 85°C.

7. Handling:

   • Handle the device with care to avoid electrostatic discharge (ESD) damage.
   • Follow standard ESD precautions when handling and soldering the device.

8. Storage:

   • Store the device in a dry, cool place away from direct sunlight and sources of heat.

9. Testing:

   • Before integrating the device into a circuit, test it under controlled conditions to ensure proper functionality.

10. Layout Considerations:

    • Use short and direct traces for power and ground connections to minimize noise and improve performance.
    • Place decoupling capacitors close to the V_CC and GND pins to filter out high-frequency noise.