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TA75074F

Specifications

SKU: 1463105

BUY TA75074F https://www.utsource.net/itm/p/1463105.html
Shortform IC and Component Datasheets (Plus Cross Reference Data)
Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage Vcc - 4.5 - 16 V
Standby Current Icc(S) Vcc = 5V - 20 - μA
Operating Current Icc(O) Vcc = 5V, fO = 1kHz - 300 - μA
Output Power POM Vcc = 5V, RL = 8Ω, fO = 1kHz - 220 - mW
Total Harmonic Distortion THD Vcc = 5V, RL = 8Ω, fO = 1kHz - 0.5 - %
S/N Ratio SNR Vcc = 5V, RL = 8Ω, fO = 1kHz - 60 - dB
Input Sensitivity Vi Vcc = 5V, fO = 1kHz 200 - 1000 mV
Input Impedance Zi - 47 - -
Shutdown Input Voltage Vshd - 0.8 - 1.2 V
Mute Input Voltage Vmute - 0.8 - 1.2 V

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the range of 4.5V to 16V.
    • Use a stable power source to avoid fluctuations that could affect performance.
  2. Standby Mode:

    • To enter standby mode, apply a high level (greater than 1.2V) to the shutdown input (Vshd).
    • In standby mode, the current consumption is minimized to about 20μA.
  3. Mute Function:

    • To mute the output, apply a high level (greater than 1.2V) to the mute input (Vmute).
    • This function can be used to prevent popping sounds during power-up or power-down.
  4. Input Signal:

    • The input sensitivity ranges from 200mV to 1000mV for optimal operation.
    • Ensure the input signal is within this range to achieve the best audio quality.
  5. Output Configuration:

    • Connect the speaker (RL) with an impedance of 8Ω for maximum output power of 220mW at 1kHz.
    • Keep the total harmonic distortion (THD) below 0.5% for high-fidelity sound.
  6. Circuit Protection:

    • The IC includes built-in thermal protection to prevent damage from overheating.
    • Ensure proper heat dissipation by using a heatsink if necessary, especially at higher power levels.
  7. Layout Considerations:

    • Place decoupling capacitors close to the power pins to reduce noise and improve stability.
    • Use short and wide traces for power and ground connections to minimize inductance and resistance.
  8. Storage and Handling:

    • Store the IC in a dry environment to prevent moisture damage.
    • Handle with care to avoid static discharge, which can damage the internal components.
(For reference only)

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