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2SC4538

Specifications

SKU: 1466441

BUY 2SC4538 https://www.utsource.net/itm/p/1466441.html
SC70/µDFN, Single/Dual Low-Voltage, Low-Power µP Reset Circuits
Parameter Symbol Min Typical Max Unit
Collector-Emitter Voltage Vceo - - 60 V
Collector-Base Voltage Vcbo - - 70 V
Emitter-Base Voltage Vebo -5 - -1 V
Collector Current Ic - - 3 A
Base Current Ib - - 0.3 A
Power Dissipation Ptot - - 65 W
Transition Frequency Ft - 150 - MHz
Storage Temperature Range Tstg -55 - 150 °C
Operating Temperature Range Topr -55 - 150 °C

Instructions for Use:

  1. Mounting:

    • Ensure proper heat sinking to manage power dissipation.
    • Use a suitable thermal compound between the transistor and the heat sink for efficient heat transfer.
  2. Biasing:

    • Set the base current (Ib) to ensure the transistor operates in the desired region (saturation, active, or cutoff).
    • Use a current-limiting resistor in series with the base to prevent excessive base current.
  3. Voltage Ratings:

    • Do not exceed the maximum collector-emitter voltage (Vceo), collector-base voltage (Vcbo), and emitter-base voltage (Vebo).
    • Ensure that the operating voltages are within the specified limits to avoid damage to the transistor.
  4. Current Ratings:

    • The maximum collector current (Ic) should not be exceeded.
    • The base current (Ib) should be kept below the maximum limit to prevent overheating and potential damage.
  5. Power Dissipation:

    • Monitor the power dissipation (Ptot) to ensure it does not exceed the maximum rating.
    • Proper cooling is essential to maintain the junction temperature within safe limits.
  6. Frequency Considerations:

    • The transition frequency (Ft) indicates the frequency at which the gain drops to unity. Design circuits considering this parameter to ensure stable operation at high frequencies.
  7. Temperature Range:

    • Store and operate the transistor within the specified storage (Tstg) and operating (Topr) temperature ranges to ensure reliability and longevity.
  8. Handling:

    • Handle the transistor with care to avoid mechanical stress and static discharge.
    • Use appropriate ESD protection when handling the device to prevent damage from electrostatic discharge.
  9. Testing:

    • Test the transistor in a controlled environment to verify its performance parameters before integrating it into the final application.
  10. Soldering:

    • Follow recommended soldering profiles to avoid thermal shock and ensure a reliable connection.
    • Avoid excessive heat during soldering to prevent damage to the transistor.
(For reference only)

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