Specifications
SKU: 1466441
SC70/µDFN, Single/Dual Low-Voltage, Low-Power µP Reset Circuits
Parameter | Symbol | Min | Typical | Max | Unit |
---|---|---|---|---|---|
Collector-Emitter Voltage | Vceo | - | - | 60 | V |
Collector-Base Voltage | Vcbo | - | - | 70 | V |
Emitter-Base Voltage | Vebo | -5 | - | -1 | V |
Collector Current | Ic | - | - | 3 | A |
Base Current | Ib | - | - | 0.3 | A |
Power Dissipation | Ptot | - | - | 65 | W |
Transition Frequency | Ft | - | 150 | - | MHz |
Storage Temperature Range | Tstg | -55 | - | 150 | °C |
Operating Temperature Range | Topr | -55 | - | 150 | °C |
Instructions for Use:
Mounting:
- Ensure proper heat sinking to manage power dissipation.
- Use a suitable thermal compound between the transistor and the heat sink for efficient heat transfer.
Biasing:
- Set the base current (Ib) to ensure the transistor operates in the desired region (saturation, active, or cutoff).
- Use a current-limiting resistor in series with the base to prevent excessive base current.
Voltage Ratings:
- Do not exceed the maximum collector-emitter voltage (Vceo), collector-base voltage (Vcbo), and emitter-base voltage (Vebo).
- Ensure that the operating voltages are within the specified limits to avoid damage to the transistor.
Current Ratings:
- The maximum collector current (Ic) should not be exceeded.
- The base current (Ib) should be kept below the maximum limit to prevent overheating and potential damage.
Power Dissipation:
- Monitor the power dissipation (Ptot) to ensure it does not exceed the maximum rating.
- Proper cooling is essential to maintain the junction temperature within safe limits.
Frequency Considerations:
- The transition frequency (Ft) indicates the frequency at which the gain drops to unity. Design circuits considering this parameter to ensure stable operation at high frequencies.
Temperature Range:
- Store and operate the transistor within the specified storage (Tstg) and operating (Topr) temperature ranges to ensure reliability and longevity.
Handling:
- Handle the transistor with care to avoid mechanical stress and static discharge.
- Use appropriate ESD protection when handling the device to prevent damage from electrostatic discharge.
Testing:
- Test the transistor in a controlled environment to verify its performance parameters before integrating it into the final application.
Soldering:
- Follow recommended soldering profiles to avoid thermal shock and ensure a reliable connection.
- Avoid excessive heat during soldering to prevent damage to the transistor.
Inquiry - 2SC4538