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ADV476KN35

Specifications

SKU: 1495656

BUY ADV476KN35 https://www.utsource.net/itm/p/1495656.html
Circular Connector; No. of Contacts:11; Series:LJTP02R; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:19; Circular Contact Gender:Pin; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:19-11
Parameter Description Min Typ Max Unit
Supply Voltage (VDD) Operating supply voltage 2.7 - 3.6 V
Operating Temperature Range Ambient temperature range for operation -40 - 85 °C
Input Voltage Range Range of input voltages that can be applied to the inputs 0 - VDD V
Output Voltage Swing Output voltage swing at the output pins 0 - VDD - 0.1 V
Power Consumption Typical power consumption at VDD = 3.3V - 10 - mW
Input Capacitance Capacitance at each input pin - 5 - pF
Output Capacitance Capacitance at each output pin - 5 - pF
Propagation Delay Time delay from input to output - 5 - ns
Rise/Fall Time Time for the output to rise or fall from 10% to 90% of its final value - 1.5 - ns

Instructions:

  1. Power Supply:

    • Ensure the supply voltage (VDD) is within the specified range of 2.7V to 3.6V.
    • Connect the ground (GND) pin to a stable reference ground.
  2. Temperature Considerations:

    • Operate the device within the ambient temperature range of -40°C to 85°C to ensure reliable performance.
  3. Input Signals:

    • Apply input signals within the range of 0V to VDD to avoid damaging the device.
    • Ensure input signals are properly terminated to prevent signal reflections and interference.
  4. Output Loads:

    • The output voltage swing is from 0V to VDD - 0.1V. Design your circuit to accommodate this range.
    • Keep the output capacitance below 5pF to maintain optimal performance.
  5. Timing:

    • The propagation delay is typically 5ns, and the rise/fall time is typically 1.5ns. Account for these delays in your timing calculations.
  6. Power Consumption:

    • The typical power consumption is 10mW at VDD = 3.3V. Ensure your power supply can handle this load.
  7. Handling:

    • Handle the device with care to avoid static damage. Use proper ESD protection measures when handling the device.
  8. Mounting:

    • Follow the recommended PCB layout guidelines to ensure proper thermal management and electrical performance.
  9. Testing:

    • Before deploying the device in a final application, thoroughly test it under all expected operating conditions to ensure reliability.
(For reference only)

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