Specifications
SKU: 1495656
Circular Connector; No. of Contacts:11; Series:LJTP02R; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:19; Circular Contact Gender:Pin; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:19-11
Parameter | Description | Min | Typ | Max | Unit |
---|---|---|---|---|---|
Supply Voltage (VDD) | Operating supply voltage | 2.7 | - | 3.6 | V |
Operating Temperature Range | Ambient temperature range for operation | -40 | - | 85 | °C |
Input Voltage Range | Range of input voltages that can be applied to the inputs | 0 | - | VDD | V |
Output Voltage Swing | Output voltage swing at the output pins | 0 | - | VDD - 0.1 | V |
Power Consumption | Typical power consumption at VDD = 3.3V | - | 10 | - | mW |
Input Capacitance | Capacitance at each input pin | - | 5 | - | pF |
Output Capacitance | Capacitance at each output pin | - | 5 | - | pF |
Propagation Delay | Time delay from input to output | - | 5 | - | ns |
Rise/Fall Time | Time for the output to rise or fall from 10% to 90% of its final value | - | 1.5 | - | ns |
Instructions:
Power Supply:
- Ensure the supply voltage (VDD) is within the specified range of 2.7V to 3.6V.
- Connect the ground (GND) pin to a stable reference ground.
Temperature Considerations:
- Operate the device within the ambient temperature range of -40°C to 85°C to ensure reliable performance.
Input Signals:
- Apply input signals within the range of 0V to VDD to avoid damaging the device.
- Ensure input signals are properly terminated to prevent signal reflections and interference.
Output Loads:
- The output voltage swing is from 0V to VDD - 0.1V. Design your circuit to accommodate this range.
- Keep the output capacitance below 5pF to maintain optimal performance.
Timing:
- The propagation delay is typically 5ns, and the rise/fall time is typically 1.5ns. Account for these delays in your timing calculations.
Power Consumption:
- The typical power consumption is 10mW at VDD = 3.3V. Ensure your power supply can handle this load.
Handling:
- Handle the device with care to avoid static damage. Use proper ESD protection measures when handling the device.
Mounting:
- Follow the recommended PCB layout guidelines to ensure proper thermal management and electrical performance.
Testing:
- Before deploying the device in a final application, thoroughly test it under all expected operating conditions to ensure reliability.
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