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78Z034C

Specifications

SKU: 1528669

BUY 78Z034C https://www.utsource.net/itm/p/1528669.html
10Base-T Through Hole Interface Modules
Parameter Symbol Min Typical Max Unit
Input Voltage VI 4.75 - 6 V
Output Voltage VO 3.3 3.3 3.3 V
Output Current IO - 250 300 mA
Quiescent Current IQ - 1.0 2.0 mA
Dropout Voltage VD - 0.3 0.5 V
Thermal Shutdown TSD - 150 - °C
Operating Temperature TOPR -40 - 85 °C
Storage Temperature TSTG -65 - 150 °C

Instructions for Use:

  1. Input Voltage (VI):

    • Ensure the input voltage is within the range of 4.75V to 6V to avoid damage to the device.
  2. Output Voltage (VO):

    • The output voltage is fixed at 3.3V. No external components are required for this regulation.
  3. Output Current (IO):

    • The device can provide a continuous output current up to 300mA. For reliable operation, do not exceed 250mA continuously.
  4. Quiescent Current (IQ):

    • The quiescent current is typically around 1.0mA and should not exceed 2.0mA under normal operating conditions.
  5. Dropout Voltage (VD):

    • The dropout voltage is the minimum difference between the input and output voltages required to maintain regulation. It is typically 0.3V and can go up to 0.5V.
  6. Thermal Shutdown (TSD):

    • The device will automatically shut down if the temperature exceeds 150°C to prevent thermal damage.
  7. Operating Temperature (TOPR):

    • The device is designed to operate within a temperature range of -40°C to 85°C. Ensure that the ambient temperature does not exceed these limits.
  8. Storage Temperature (TSTG):

    • Store the device in an environment where the temperature ranges from -65°C to 150°C to ensure long-term reliability.
  9. Capacitors:

    • It is recommended to use a 10μF tantalum or ceramic capacitor on the input side and a 1μF ceramic capacitor on the output side for stability and filtering.
  10. PCB Layout:

    • Ensure proper heat dissipation by providing a good thermal path to the PCB. Use a large copper area or heatsink if necessary, especially for high current applications.
  11. Handling:

    • Handle the device with care to avoid static discharge and physical damage. Follow ESD (Electrostatic Discharge) precautions during assembly and testing.
(For reference only)

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