Specifications
SKU: 1528669
10Base-T Through Hole Interface Modules
Parameter | Symbol | Min | Typical | Max | Unit |
---|---|---|---|---|---|
Input Voltage | VI | 4.75 | - | 6 | V |
Output Voltage | VO | 3.3 | 3.3 | 3.3 | V |
Output Current | IO | - | 250 | 300 | mA |
Quiescent Current | IQ | - | 1.0 | 2.0 | mA |
Dropout Voltage | VD | - | 0.3 | 0.5 | V |
Thermal Shutdown | TSD | - | 150 | - | °C |
Operating Temperature | TOPR | -40 | - | 85 | °C |
Storage Temperature | TSTG | -65 | - | 150 | °C |
Instructions for Use:
Input Voltage (VI):
- Ensure the input voltage is within the range of 4.75V to 6V to avoid damage to the device.
Output Voltage (VO):
- The output voltage is fixed at 3.3V. No external components are required for this regulation.
Output Current (IO):
- The device can provide a continuous output current up to 300mA. For reliable operation, do not exceed 250mA continuously.
Quiescent Current (IQ):
- The quiescent current is typically around 1.0mA and should not exceed 2.0mA under normal operating conditions.
Dropout Voltage (VD):
- The dropout voltage is the minimum difference between the input and output voltages required to maintain regulation. It is typically 0.3V and can go up to 0.5V.
Thermal Shutdown (TSD):
- The device will automatically shut down if the temperature exceeds 150°C to prevent thermal damage.
Operating Temperature (TOPR):
- The device is designed to operate within a temperature range of -40°C to 85°C. Ensure that the ambient temperature does not exceed these limits.
Storage Temperature (TSTG):
- Store the device in an environment where the temperature ranges from -65°C to 150°C to ensure long-term reliability.
Capacitors:
- It is recommended to use a 10μF tantalum or ceramic capacitor on the input side and a 1μF ceramic capacitor on the output side for stability and filtering.
PCB Layout:
- Ensure proper heat dissipation by providing a good thermal path to the PCB. Use a large copper area or heatsink if necessary, especially for high current applications.
Handling:
- Handle the device with care to avoid static discharge and physical damage. Follow ESD (Electrostatic Discharge) precautions during assembly and testing.
Inquiry - 78Z034C