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MC1455BDR2G

Specifications

SKU: 1541881

BUY MC1455BDR2G https://www.utsource.net/itm/p/1541881.html
Timers
Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage Vcc 4.75 5 5.25 V
Quiescent Current IQ Vcc = 5V - 1.8 - mA
Output Current (Source) Iout Vcc = 5V 0 10 20 mA
Output Current (Sink) Iout Vcc = 5V 0 10 20 mA
Output Voltage (High) VOH Iout = 0.1mA 3.5 4.5 5 V
Output Voltage (Low) VOL Iout = 20mA 0 0.5 0.8 V
Input Voltage (High) VIH 3 3.5 5 V
Input Voltage (Low) VIL 0 1.5 2 V
Propagation Delay Time tpd Vcc = 5V, Iout = 5mA - 10 20 ns
Operating Temperature Toper -40 - 85 °C
Storage Temperature Tstg -65 - 150 °C

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage is within the specified range of 4.75V to 5.25V.
    • Use a stable power source to avoid fluctuations that could affect performance.
  2. Quiescent Current:

    • The quiescent current is typically 1.8mA at 5V. Ensure your power supply can handle this current draw.
  3. Output Current:

    • The device can source or sink up to 20mA. Ensure connected loads do not exceed these limits to prevent damage.
  4. Output Voltage Levels:

    • When sourcing current, the output voltage should be between 3.5V and 5V.
    • When sinking current, the output voltage should be between 0V and 0.8V.
  5. Input Voltage Levels:

    • For a high input, the voltage should be between 3V and 5V.
    • For a low input, the voltage should be between 0V and 2V.
  6. Propagation Delay:

    • The typical propagation delay is 10ns, with a maximum of 20ns. This is important for timing considerations in your circuit.
  7. Temperature Ranges:

    • The operating temperature range is from -40°C to 85°C.
    • The storage temperature range is from -65°C to 150°C. Ensure the device is stored within these limits to maintain reliability.
  8. Handling:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Follow proper soldering techniques to ensure reliable connections.
  9. Mounting:

    • Ensure proper mounting on the PCB to avoid mechanical stress that could lead to failure.
  10. Testing:

    • After assembly, test the device under normal operating conditions to verify functionality.

By following these guidelines, you can ensure optimal performance and longevity of the MC1455BDR2G component.

(For reference only)

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