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LTC3400ES6

Specifications

SKU: 1564795

BUY LTC3400ES6 https://www.utsource.net/itm/p/1564795.html
600mA, 1.2MHz Micropower Synchronous Boost Converter in ThinSOT
Parameter Description Min Typ Max Unit
Input Voltage (VIN) Operating input voltage range 2.7 - 5.5 V
Output Voltage (VOUT) Adjustable output voltage range 0.8 - 5.25 V
Output Current (IOUT) Continuous output current - 1.2 - A
Switching Frequency (fSW) Fixed switching frequency 1.0 - 1.0 MHz
Efficiency (η) Typical efficiency at 3.3V in, 3.3V out, 500mA load - 90 - %
Quiescent Current (IQ) Quiescent current at no load - 20 - μA
Shutdown Current (ISD) Shutdown current - 1 - μA
Dropout Voltage (VDO) Dropout voltage at 3.3V out, 500mA load - 200 - mV
Load Transient Response Load transient response from 100mA to 500mA - ±30 - mV
Line Transient Response Line transient response from 2.7V to 5.5V - ±50 - mV
Thermal Shutdown Temperature (TSD) Thermal shutdown temperature - 160 - °C
Operating Junction Temperature (TJ) Operating junction temperature range -40 - 125 °C
Package Package type - - - 6-lead TSOT-23

Instructions for Use:

  1. Input Voltage (VIN):

    • Ensure the input voltage is within the range of 2.7V to 5.5V.
    • Use appropriate input capacitors (typically 1μF to 10μF) to stabilize the input voltage.
  2. Output Voltage (VOUT):

    • Set the output voltage using external resistors according to the formula: ( V_ = 0.8 times (1 + frac) ).
    • Use a feedback resistor network to achieve the desired output voltage.
  3. Output Capacitor:

    • Use a ceramic capacitor with low ESR (Equivalent Series Resistance) for the output to ensure stability and good transient response. A typical value is 10μF.
  4. Inductor Selection:

    • Choose an inductor with a value that provides a balance between size and performance. A typical value is 4.7μH for a 1MHz switching frequency.
  5. Thermal Management:

    • Ensure adequate heat dissipation by providing a thermal path to the PCB or using a heatsink if necessary. The operating junction temperature should not exceed 125°C.
  6. Shutdown Pin:

    • To shut down the device, pull the shutdown pin (SHDN) low. The shutdown current is typically 1μA.
    • To enable the device, pull the shutdown pin high (to VIN).
  7. PCB Layout:

    • Follow good PCB layout practices to minimize noise and improve performance. Keep the input and output capacitors close to the IC and use wide traces for power paths.
  8. Capacitor Selection:

    • Use X5R or X7R ceramic capacitors for their stability and low ESR.
    • For the input capacitor, a value of 1μF to 10μF is recommended.
    • For the output capacitor, a value of 10μF is typically sufficient.
  9. Testing:

    • Before finalizing the design, test the circuit under various load conditions to ensure stability and performance meet the requirements.
  10. Storage:

    • Store the device in a dry environment to prevent moisture damage. Follow the recommended storage conditions provided by the manufacturer.
(For reference only)

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