Specifications
SKU: 1581788
Parameter | Symbol | Min | Typical | Max | Unit |
---|---|---|---|---|---|
Supply Voltage | Vcc | 4.5 | - | 5.5 | V |
Operating Temperature | Topr | -40 | - | 85 | °C |
Storage Temperature | Tstg | -65 | - | 150 | °C |
Output Current | Iout | - | 100 | 150 | mA |
Input Capacitance | Cin | - | 10 | - | pF |
Output Capacitance | Cout | - | 5 | - | pF |
Quiescent Current | Iq | - | 1 | 2 | μA |
Rise Time | Tr | - | 10 | 20 | ns |
Fall Time | Tf | - | 10 | 20 | ns |
Propagation Delay | Tpd | - | 15 | 25 | ns |
Instructions for Use:
Power Supply:
- Ensure the supply voltage (Vcc) is within the range of 4.5V to 5.5V.
- Use a stable power source to avoid voltage fluctuations that could affect performance.
Temperature Considerations:
- The device is designed to operate within a temperature range of -40°C to 85°C.
- Store the device in temperatures between -65°C and 150°C to ensure long-term reliability.
Output Current:
- The typical output current is 100mA, with a maximum of 150mA.
- Avoid exceeding the maximum output current to prevent damage to the device.
Capacitance:
- The input capacitance (Cin) is typically 10pF.
- The output capacitance (Cout) is typically 5pF.
- These values should be considered when designing circuits to ensure proper signal integrity.
Quiescent Current:
- The quiescent current (Iq) is typically 1μA, with a maximum of 2μA.
- This low quiescent current makes the device suitable for battery-powered applications.
Timing Parameters:
- The rise time (Tr) and fall time (Tf) are both typically 10ns, with a maximum of 20ns.
- The propagation delay (Tpd) is typically 15ns, with a maximum of 25ns.
- These timing parameters are crucial for ensuring the device operates correctly in high-speed applications.
Handling and Storage:
- Handle the device with care to avoid static discharge, which can damage sensitive components.
- Store the device in a dry, cool place to prevent moisture-related issues.
Mounting and Soldering:
- Follow standard soldering practices to ensure a reliable connection.
- Avoid overheating during soldering, as this can damage the device.
Testing:
- Before integrating the device into a circuit, test it using the specified operating conditions to ensure it meets the required performance specifications.
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