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30G121

Specifications

SKU: 1581788

BUY 30G121 https://www.utsource.net/itm/p/1581788.html

Parameter Symbol Min Typical Max Unit
Supply Voltage Vcc 4.5 - 5.5 V
Operating Temperature Topr -40 - 85 °C
Storage Temperature Tstg -65 - 150 °C
Output Current Iout - 100 150 mA
Input Capacitance Cin - 10 - pF
Output Capacitance Cout - 5 - pF
Quiescent Current Iq - 1 2 μA
Rise Time Tr - 10 20 ns
Fall Time Tf - 10 20 ns
Propagation Delay Tpd - 15 25 ns

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the range of 4.5V to 5.5V.
    • Use a stable power source to avoid voltage fluctuations that could affect performance.
  2. Temperature Considerations:

    • The device is designed to operate within a temperature range of -40°C to 85°C.
    • Store the device in temperatures between -65°C and 150°C to ensure long-term reliability.
  3. Output Current:

    • The typical output current is 100mA, with a maximum of 150mA.
    • Avoid exceeding the maximum output current to prevent damage to the device.
  4. Capacitance:

    • The input capacitance (Cin) is typically 10pF.
    • The output capacitance (Cout) is typically 5pF.
    • These values should be considered when designing circuits to ensure proper signal integrity.
  5. Quiescent Current:

    • The quiescent current (Iq) is typically 1μA, with a maximum of 2μA.
    • This low quiescent current makes the device suitable for battery-powered applications.
  6. Timing Parameters:

    • The rise time (Tr) and fall time (Tf) are both typically 10ns, with a maximum of 20ns.
    • The propagation delay (Tpd) is typically 15ns, with a maximum of 25ns.
    • These timing parameters are crucial for ensuring the device operates correctly in high-speed applications.
  7. Handling and Storage:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Store the device in a dry, cool place to prevent moisture-related issues.
  8. Mounting and Soldering:

    • Follow standard soldering practices to ensure a reliable connection.
    • Avoid overheating during soldering, as this can damage the device.
  9. Testing:

    • Before integrating the device into a circuit, test it using the specified operating conditions to ensure it meets the required performance specifications.
(For reference only)

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