Instructions for Use:

1. Mounting:

   • Ensure the device is mounted on a PCB with adequate thermal management to handle the power dissipation.
   • Use appropriate soldering techniques to avoid damage from excessive heat.

2. Electrical Connections:

   • Connect the cathode (K) to the positive side of the circuit and the anode (A) to the negative side.
   • Ensure all connections are secure and free from shorts or open circuits.

3. Thermal Management:

   • The device can dissipate significant power during peak pulse conditions. Use a heatsink if necessary to maintain the junction temperature within the specified limits.

4. Handling:

   • Handle the device with care to avoid mechanical stress or damage.
   • Follow ESD (Electrostatic Discharge) precautions to prevent damage from static electricity.

5. Storage:

   • Store the device in a dry, cool place within the specified storage temperature range to ensure long-term reliability.

6. Testing:

   • Before final assembly, test the device to ensure it meets the specified electrical parameters.
   • Use a suitable tester or multimeter to verify the breakdown voltage and leakage current.

7. Compliance:

   • Ensure the device complies with relevant safety and regulatory standards for the intended application.