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NJM4587L

Specifications

SKU: 1718083

BUY NJM4587L https://www.utsource.net/itm/p/1718083.html
Dual Operational Amplifier,
Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VCC - 1.8 - 5.5 V
Supply Current ICC VCC = 3V, f = 1kHz, VOUT = 0V - 200 - μA
Output Voltage Swing VOUT VCC = 3V, RL = 600Ω 0.1 - 2.9 V
Input Offset Voltage VIO - - 2 - mV
Input Bias Current IB - - 0.5 - μA
Slew Rate SR VCC = 3V, RL = 1kΩ - 0.5 - V/μs
Gain Bandwidth Product GBP - - 1.5 - MHz
Common Mode Rejection Ratio CMRR VCC = 3V, f = 1kHz - 70 - dB
Power Supply Rejection Ratio PSRR VCC = 3V, f = 1kHz - 80 - dB

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 1.8V to 5.5V.
    • Connect a bypass capacitor (typically 0.1μF) between VCC and ground to stabilize the power supply.
  2. Input Configuration:

    • The input offset voltage (VIO) is typically 2mV. For precision applications, consider using a potentiometer to null the offset.
    • The input bias current (IB) is 0.5μA. Use high-impedance sources or buffer stages if necessary.
  3. Output Configuration:

    • The output voltage swing (VOUT) can range from 0.1V to 2.9V when VCC is 3V and the load resistance (RL) is 600Ω.
    • Ensure the load resistance is appropriate for the desired output voltage swing.
  4. Frequency Response:

    • The gain bandwidth product (GBP) is 1.5MHz, which limits the frequency response of the amplifier.
    • The slew rate (SR) is 0.5V/μs, which affects the ability to reproduce high-frequency signals accurately.
  5. Noise and Distortion:

    • The common mode rejection ratio (CMRR) is 70dB, indicating good rejection of common-mode noise.
    • The power supply rejection ratio (PSRR) is 80dB, which helps in maintaining performance despite variations in the power supply.
  6. Thermal Considerations:

    • Ensure proper heat dissipation if the device is operating at high power levels or in high ambient temperatures.
  7. Storage and Handling:

    • Store the device in a dry, cool environment to prevent damage.
    • Handle with care to avoid static discharge, which can damage the internal components.
  8. Mounting:

    • Follow the recommended PCB layout guidelines to ensure optimal performance and reliability.
    • Use appropriate soldering techniques to avoid thermal stress on the device.
(For reference only)

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