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HM511000AP-10

Specifications

SKU: 1734429

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x1 Fast Page Mode DRAM
Parameter Description Value
Part Number Full Part Number HM511000AP-10
Type Device Type EEPROM (Electrically Erasable Programmable Read-Only Memory)
Capacity Memory Capacity 1 Mbit (128 K x 8)
Vcc Range Operating Voltage 1.7 V to 3.6 V
Icc Supply Current (Typical) 1.0 mA (Active), 1.0 μA (Standby)
Data Retention Data Retention Time 100 years
Write Cycle Write Cycles 1,000,000 cycles
Access Time Access Time 100 ns (max)
Operating Temperature Temperature Range -40°C to +85°C
Package Package Type SOIC-8 (Small Outline Integrated Circuit)
Pin Configuration Pin Count 8
Interface Communication Interface I2C (Inter-Integrated Circuit)
Clock Speed Maximum Clock Speed 400 kHz (Standard Mode), 1 MHz (Fast Mode)
Write Protection Write Protect Feature Hardware Write Protect Pin
Package Marking Marking on Package HM511000AP-10
RoHS Compliance RoHS Compliant Yes

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the specified range of 1.7 V to 3.6 V.
    • Connect the ground (GND) pin to the system ground.
  2. Communication:

    • Use the I2C interface for communication with the device.
    • Connect the SDA (Serial Data) and SCL (Serial Clock) pins to the corresponding lines on the I2C bus.
    • Pull-up resistors (typically 4.7 kΩ) should be connected to both SDA and SCL lines.
  3. Write Protection:

    • The WP (Write Protect) pin can be used to prevent accidental writes to the memory.
    • Set the WP pin to high (Vcc) to enable write protection.
    • Set the WP pin to low (GND) to allow writing to the memory.
  4. Addressing:

    • The device has a fixed I2C address, which is typically 0x50 (7-bit address).
    • Refer to the datasheet for any additional address configuration options.
  5. Programming:

    • Use standard I2C commands to read from and write to the memory.
    • Ensure that the device is not powered down during a write operation to avoid data corruption.
  6. Handling:

    • Handle the device with care to avoid static discharge, which can damage the IC.
    • Store the device in an ESD (Electrostatic Discharge) protected environment when not in use.
  7. Mounting:

    • Solder the device onto the PCB (Printed Circuit Board) using standard surface mount technology (SMT) techniques.
    • Ensure proper alignment and soldering to avoid short circuits or poor connections.
  8. Testing:

    • After mounting, test the device to ensure it is functioning correctly.
    • Verify the I2C communication and memory read/write operations.

For more detailed information, refer to the datasheet provided by the manufacturer.

(For reference only)

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