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MC74AC00N

Specifications

SKU: 1739816

BUY MC74AC00N https://www.utsource.net/itm/p/1739816.html
Quad 2-Input NAND Gate; Package: PDIP-14; No of Pins: 14; Container: Rail; Qty per Container: 500
Parameter Symbol Min Typ Max Unit Description
Supply Voltage VCC 2.0 - 5.5 V Operating supply voltage range
Input Low Voltage VIL - - 1.5 V Maximum input voltage to be recognized as low
Input High Voltage VIH 3.5 - - V Minimum input voltage to be recognized as high
Output Low Voltage VOL - 0.1 0.4 V Maximum output voltage when low (at IOL = 16 mA)
Output High Voltage VOH 2.4 - - V Minimum output voltage when high (at IOH = -4 mA)
Input Leakage Current IIL - - ±1.0 μA Maximum leakage current at input pins
Output Sink Current IOL - - 16 mA Maximum sink current per output pin
Output Source Current IOH - - -4 mA Maximum source current per output pin
Propagation Delay Time tpd - 6 - ns Typical propagation delay time (VCC = 5V, TA = 25°C)
Power Dissipation PD - - 100 mW Maximum power dissipation per package
Operating Temperature TA -40 - 85 °C Ambient operating temperature range
Storage Temperature TSTG -65 - 150 °C Storage temperature range

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the specified range of 2.0V to 5.5V.
    • Connect the ground (GND) pin to a stable ground reference.
  2. Input Signals:

    • Apply input signals that are within the valid logic levels:
      • Low: 0V to 1.5V
      • High: 3.5V to VCC
    • Ensure input signals do not exceed the supply voltage to avoid damage.
  3. Output Loads:

    • The output pins can sink up to 16 mA and source up to -4 mA.
    • Connect appropriate loads to ensure the current does not exceed these limits.
  4. Propagation Delay:

    • The typical propagation delay time is 6 ns at VCC = 5V and TA = 25°C.
    • Consider this delay in your timing calculations.
  5. Temperature Range:

    • Operate the device within the ambient temperature range of -40°C to 85°C.
    • Store the device within the temperature range of -65°C to 150°C.
  6. Power Dissipation:

    • Ensure the total power dissipation does not exceed 100 mW to prevent overheating.
    • Use heat sinks or other cooling methods if necessary.
  7. Handling:

    • Handle the device with care to avoid static discharge.
    • Follow proper ESD (Electrostatic Discharge) precautions during handling and installation.
  8. Mounting:

    • Mount the device on a PCB using standard soldering techniques.
    • Ensure good thermal and electrical connections.
  9. Testing:

    • Test the device under the specified operating conditions to ensure proper functionality.
    • Use appropriate test equipment and procedures to validate performance.
(For reference only)

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