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MC10H105P

Specifications

SKU: 1751182

BUY MC10H105P https://www.utsource.net/itm/p/1751182.html
Triple 2-3-2-Input OR/NOR Gate; Package: PDIP-16; No of Pins: 16; Container: Rail; Qty per Container: 25
Parameter Symbol Min Typ Max Unit Conditions
Supply Voltage VDD 1.8 3.6 5.5 V
Output Voltage (High) VOH 3.5 5.5 V IOH = -4 mA, VDD = 5.5V
Output Voltage (Low) VOL 0 0.4 V IOL = 4 mA, VDD = 5.5V
Input Voltage (High) VIH 2.0 5.5 V
Input Voltage (Low) VIL 0 0.8 V
Propagation Delay tpd 7 15 ns VDD = 5.5V, TA = 25°C
Power Consumption ICC 1 5 μA VDD = 5.5V, No Load
Operating Temperature Toper -40 85 °C
Storage Temperature Tstg -65 150 °C

Instructions for Use:

  1. Supply Voltage (VDD):

    • Ensure the supply voltage is within the range of 1.8V to 5.5V.
    • Do not exceed the maximum voltage rating to avoid damaging the device.
  2. Output Voltage:

    • For high output (VOH), ensure the load current does not exceed -4 mA.
    • For low output (VOL), ensure the load current does not exceed 4 mA.
  3. Input Voltage:

    • Ensure input voltages are within the specified range to avoid incorrect operation or damage.
    • VIH should be at least 2.0V for a valid high input.
    • VIL should be no more than 0.8V for a valid low input.
  4. Propagation Delay (tpd):

    • The typical propagation delay is 7 ns at 5.5V supply voltage and 25°C ambient temperature.
    • Consider this delay in timing-sensitive applications.
  5. Power Consumption (ICC):

    • The typical power consumption is 1 μA at 5.5V supply voltage with no load.
    • Monitor power consumption in low-power designs.
  6. Temperature Ranges:

    • The operating temperature range is -40°C to 85°C.
    • The storage temperature range is -65°C to 150°C.
    • Ensure the device operates within these temperature limits to maintain reliability.
  7. Handling:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Follow ESD (Electrostatic Discharge) precautions during handling and installation.
  8. Mounting:

    • Solder the device according to the recommended soldering profile to ensure proper thermal and electrical connections.
    • Avoid excessive heat during soldering to prevent damage to the device.
  9. Testing:

    • Test the device under typical operating conditions to verify its functionality.
    • Use appropriate test equipment and methods to ensure accurate results.
(For reference only)

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