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GM76C256CLLFW-70

Specifications

SKU: 1751317

BUY GM76C256CLLFW-70 https://www.utsource.net/itm/p/1751317.html
x8 SRAM
Parameter Description Value
Device Type CMOS 256K x 8-bit SRAM
Package 44-pin TQFP (10x10x1.0mm)
Operating Voltage (Vcc) 3.3V ± 0.3V 3.0V to 3.6V
Standby Current (Icc) Vcc = 3.3V, Ta = 25°C 1 μA
Active Current (Icc) Vcc = 3.3V, f = 70 MHz, Ta = 25°C 10 mA
Access Time (tAA) Vcc = 3.3V, f = 70 MHz, Ta = 25°C 7 ns
Data Retention (tR) Vcc = 3.3V, Ta = -40°C to +85°C 10 years
Temperature Range (Ta) Industrial Temperature Range -40°C to +85°C
Write Cycle Time (tWC) Vcc = 3.3V, f = 70 MHz, Ta = 25°C 7 ns
Read Cycle Time (tRC) Vcc = 3.3V, f = 70 MHz, Ta = 25°C 7 ns
Output Enable (OE) Delay (tOE) Vcc = 3.3V, f = 70 MHz, Ta = 25°C 2 ns
Write Enable (WE) Delay (tWE) Vcc = 3.3V, f = 70 MHz, Ta = 25°C 2 ns
Chip Enable (CE) Delay (tCE) Vcc = 3.3V, f = 70 MHz, Ta = 25°C 2 ns
Output Disable Time (tOH) Vcc = 3.3V, f = 70 MHz, Ta = 25°C 2 ns
Power-down Mode Active Low
Pin Configuration CE, OE, WE, A0-A18, D0-D7, Vcc, GND

Instructions for Use

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the specified range of 3.0V to 3.6V.
    • Connect the ground (GND) pin to a stable ground reference.
  2. Signal Timing:

    • The device operates at a maximum clock frequency of 70 MHz.
    • Ensure that all timing parameters (tAA, tWC, tRC, tOE, tWE, tCE, tOH) are met to avoid data corruption or read/write errors.
  3. Power Management:

    • To enter power-down mode, set the Chip Enable (CE) pin to a high state.
    • The standby current (Icc) is minimized in this mode to 1 μA.
  4. Temperature Considerations:

    • The device is rated for operation from -40°C to +85°C.
    • Data retention is guaranteed for up to 10 years under these temperature conditions.
  5. Pin Connections:

    • Connect the address lines (A0-A18) to the appropriate address bus.
    • Connect the data lines (D0-D7) to the data bus.
    • Control signals (CE, OE, WE) should be connected to the corresponding control lines on your system.
  6. Handling Precautions:

    • Handle the device with care to avoid electrostatic discharge (ESD).
    • Follow standard ESD protection guidelines during assembly and handling.
  7. Storage:

    • Store the device in a dry, cool environment to prevent moisture damage.
    • Use anti-static packaging when storing or transporting the device.
(For reference only)

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