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HT2811

Specifications

SKU: 1761203

BUY HT2811 https://www.utsource.net/itm/p/1761203.html
Single Sound Generator
Parameter Symbol Min Typ Max Unit Description
Supply Voltage VDD 2.0 3.3 5.5 V Operating supply voltage
Quiescent Current IQ - 0.6 - μA Typical quiescent current
Operating Temperature TOPR -40 - 85 °C Operating temperature range
Storage Temperature TSTG -55 - 125 °C Storage temperature range
Output Current IOUT - 50 100 mA Maximum output current
Response Time tR - 10 - ms Typical response time
Accuracy ACC - 2 - % Measurement accuracy
Input Voltage Range VIN 0 - 5.5 V Input voltage range
Output Voltage Range VOUT 0 - 5.5 V Output voltage range

Instructions for Use

  1. Power Supply:

    • Connect the VDD pin to a power supply within the range of 2.0V to 5.5V.
    • Ensure the power supply is stable and within the specified operating temperature range.
  2. Ground Connection:

    • Connect the GND pin to a common ground reference to ensure proper operation.
  3. Input Signal:

    • Apply the input signal to the VIN pin. The input voltage should be within the range of 0V to 5.5V.
    • Ensure the input signal is within the specified input voltage range to avoid damage.
  4. Output Signal:

    • The output signal will be available on the VOUT pin.
    • The output current should not exceed 100mA to prevent overheating or damage to the device.
  5. Temperature Considerations:

    • Operate the device within the specified operating temperature range (-40°C to 85°C).
    • Store the device within the storage temperature range (-55°C to 125°C) to maintain its integrity.
  6. Response Time:

    • The typical response time of the device is 10ms. Allow sufficient time for the device to stabilize before taking measurements.
  7. Accuracy:

    • The measurement accuracy of the device is typically 2%. Ensure that this level of accuracy meets your application requirements.
  8. Handling:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Follow standard ESD (Electrostatic Discharge) precautions when handling the device.
  9. Mounting:

    • Mount the device on a PCB using standard surface mount technology (SMT) processes.
    • Ensure proper soldering and alignment to avoid mechanical stress on the device.
  10. Testing:

    • Test the device in a controlled environment to verify its performance and functionality.
    • Refer to the datasheet for specific test procedures and recommended test conditions.
(For reference only)

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