Share:


DM74185AN

Specifications

SKU: 1824355

BUY DM74185AN https://www.utsource.net/itm/p/1824355.html
BCD-to-Binary and Binary-to-BCD Converters
Parameter Description Min Typ Max Unit
VCC Supply Voltage 4.75 5.0 5.25 V
ICC Supply Current (Typical) - 10 - mA
tpd Propagation Delay Time 12 - 36 ns
tphl Output High to Low Transition Time 12 - 36 ns
tplh Output Low to High Transition Time 12 - 36 ns
VIH Input High Voltage 2.0 - 5.25 V
VIL Input Low Voltage 0.0 - 0.8 V
VOH Output High Voltage 2.4 - 5.0 V
VOL Output Low Voltage 0.0 - 0.4 V
IOH Output High Current - -0.4 - mA
IOL Output Low Current - 8.0 - mA
IIN Input Leakage Current -1.0 0 1.0 μA

Instructions for Use:

  1. Supply Voltage (VCC):

    • Ensure the supply voltage is within the range of 4.75V to 5.25V to avoid damage to the device.
  2. Supply Current (ICC):

    • The typical supply current is 10mA. Design your power supply to handle this current.
  3. Propagation Delay Time (tpd):

    • The propagation delay time is between 12ns and 36ns. This is the time it takes for the output to change state after the input changes.
  4. Output Transition Times (tphl, tplh):

    • The output high to low transition time (tphl) and the output low to high transition time (tplh) are both between 12ns and 36ns. These times should be considered when designing circuits that require fast signal transitions.
  5. Input Voltage Levels (VIH, VIL):

    • Input high voltage (VIH) should be at least 2.0V and can go up to 5.25V.
    • Input low voltage (VIL) should be no more than 0.8V.
  6. Output Voltage Levels (VOH, VOL):

    • Output high voltage (VOH) should be at least 2.4V and can go up to 5.0V.
    • Output low voltage (VOL) should be no more than 0.4V.
  7. Output Current (IOH, IOL):

    • The output high current (IOH) should not exceed -0.4mA.
    • The output low current (IOL) should not exceed 8.0mA.
  8. Input Leakage Current (IIN):

    • The input leakage current is typically between -1.0μA and 1.0μA. This should be considered when designing pull-up or pull-down resistors.
  9. Handling:

    • Handle the device with care to avoid static discharge, which can damage the internal components.
    • Store the device in a dry, cool place to prevent moisture damage.
  10. Mounting:

    • Follow standard surface mount technology (SMT) guidelines for mounting the device on a PCB.
    • Ensure proper soldering techniques to avoid cold solder joints or overheating the device.
(For reference only)

 Inquiry - DM74185AN