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M3030RFEPFP

Specifications

SKU: 1865345

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Parameter Description Value
Part Number Component Identifier M3030RFEPFP
Type Component Type RF Diode
Package Encapsulation SOT-23
Operating Temperature Operating Temperature Range -55°C to 150°C
Reverse Voltage (Vr) Maximum Reverse Voltage 30V
Forward Current (If) Maximum Forward Current 300mA
Reverse Recovery Time (trr) Reverse Recovery Time 4ns
Forward Voltage (Vf) Typical Forward Voltage at 10mA 0.7V
Capacitance (Cj) Junction Capacitance at 0V 4pF
Power Dissipation (Pd) Maximum Power Dissipation 350mW
Storage Temperature Storage Temperature Range -65°C to 150°C

Instructions for Use:

  1. Handling Precautions:

    • Handle with care to avoid mechanical damage.
    • Use ESD-safe tools and practices to prevent electrostatic discharge.
  2. Soldering:

    • Use a temperature-controlled soldering iron or station.
    • Soldering temperature should not exceed 300°C.
    • Soldering time should be kept to a minimum, typically less than 3 seconds per joint.
  3. Mounting:

    • Ensure proper alignment of the diode on the PCB.
    • Use appropriate solder paste or flux for surface mount applications.
    • Avoid excessive thermal stress during reflow soldering.
  4. Testing:

    • Test the diode using a multimeter or diode tester to ensure correct functionality.
    • Check for continuity and reverse bias characteristics.
  5. Storage:

    • Store in a dry, cool place to prevent moisture absorption.
    • Use desiccant packets if storing for extended periods.
  6. Application:

    • Suitable for high-frequency switching and protection circuits.
    • Ideal for use in RF circuits, power supplies, and signal conditioning applications.
(For reference only)

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