BUY TPIC6273DW https://www.utsource.net/itm/p/1866395.html
The TPIC6273DW is a monolithic high-voltage high-current power logic octal D Latch with DMOS transistor outputs designed for use in systems that require relatively high load power. The device contains a built-in voltage clamp on the outputs for inductive transient protection. Power driver applications include relays, solenoids and other medium-current or high-voltage loads. The TPIC6273 contains eight positive-edge-triggered D-type flip-flops with a direct clear input. Each flip-flop features an open-drain power DMOS transistor output. When clear (CLR) is high, information at the D inputs meeting the setup time requirements is transferred to the DRAIN outputs on the positive-going edge of the clock pulse. clock triggering occurs at a particular voltage level and is not directly related to the transition time of the positive-going pulse. When the clock input (CLK) is at either the high or low level, the D input signal has no effect at the output.

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC	Operating	4.5	-	5.5	V
Output Current per Channel	IO	Continuous	-	100	-	mA
Peak Output Current per Channel	IOPK	Pulse	-	300	-	mA
High-Level Input Voltage	VIH	Input High	2.0	-	5.5	V
Low-Level Input Voltage	VIL	Input Low	0.8	-	-	V
High-Level Output Voltage	VOH	IO = -0.1 mA	4.5	-	5.5	V
Low-Level Output Voltage	VOL	IO = 10 mA	-	0.4	-	V
Propagation Delay Time	tpd	Typical, VCC = 5V	-	15	-	ns
Power Dissipation	PD	Maximum, θJA = 62.5°C/W	-	-	1250	mW
Operating Temperature Range	TA	Commercial	-40	-	85	°C
Storage Temperature Range	TSTG	-	-40	-	150	°C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the range of 4.5V to 5.5V.
   • Use appropriate decoupling capacitors (e.g., 0.1μF ceramic capacitors) close to the power pins to stabilize the supply voltage.

2. Input Signals:

   • Apply high-level input voltages (V_IH) between 2.0V and 5.5V.
   • Apply low-level input voltages (V_IL) below 0.8V.
   • Ensure input signals are clean and free from excessive noise to avoid incorrect switching.

3. Output Load:

   • The device can provide continuous output current (I_O) up to 100mA per channel.
   • For peak loads, the device can handle up to 300mA per channel in pulse mode.
   • Ensure the load resistance is appropriate to maintain the output voltage within specified limits.

4. Propagation Delay:

   • The typical propagation delay time (t_pd) is 15ns at V_CC = 5V. This should be considered in timing-sensitive applications.

5. Thermal Management:

   • The maximum power dissipation (P_D) is 1250mW. Ensure adequate heat sinking or cooling if operating near this limit.
   • The operating temperature range (T_A) is -40°C to 85°C. Avoid operating outside this range to prevent damage.

6. Storage:

   • Store the device in a dry environment with temperatures between -40°C and 150°C to ensure long-term reliability.

7. Handling:

   • Handle the device with care to avoid static discharge, which can damage sensitive components.
   • Follow standard ESD (Electrostatic Discharge) precautions when handling and soldering the device.

8. Mounting:

   • Solder the device according to recommended reflow profiles to ensure proper bonding and minimize thermal stress.
   • Use appropriate PCB layout techniques to minimize inductance and improve signal integrity.

(For reference only)