BUY PAL007E https://www.utsource.net/itm/p/1886749.html

Description: The PAL007E is a PIONEER ZIP-25 package, a type of plastic encapsulated semiconductor package. Features: - Low profile package - High thermal performance - High reliability - Easy to assemble Applications: The PAL007E is commonly used in consumer electronics, automotive, and industrial applications. It is suitable for use in power supplies, motor drivers, and other power management applications. (For reference only)