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CY7C63001C-PXC

Specifications

SKU: 1890097

BUY CY7C63001C-PXC https://www.utsource.net/itm/p/1890097.html
Universal Serial Bus Microcontroller
Parameter Description Value
Part Number Part number of the device CY7C63001C-PXC
Function USB 2.0 High-Speed Interface Controller with USB-to-Parallel Bridge
Interface USB 2.0 High-Speed (480 Mbps)
Parallel Interface 8-bit parallel data bus
Operating Voltage Supply voltage for VCC 3.3V ± 5%
Operating Temperature Range of operating temperature -40°C to +85°C
Package Type of package 48-pin TQFP (Thin Quad Flat Package)
I/O Standards Supported I/O standards TTL, CMOS, LVTTL, LVCMOS
USB Power Consumption Maximum power consumption when connected to USB 100 mA (low power), 500 mA (high power)
Program Memory Internal program memory size 16 KB Flash
Data Memory Internal data memory size 512 bytes SRAM
Endpoints Number of endpoints 4 (1 IN, 1 OUT, 2 BULK)
Firmware Upgradable Ability to update firmware Yes
Clock Frequency Internal oscillator frequency 12 MHz
ESD Protection Electrostatic discharge protection ±2 kV (Human Body Model)

Instructions for Use

  1. Power Supply:

    • Connect the VCC pin to a 3.3V ± 5% power supply.
    • Ensure that the ground (GND) pin is properly connected to the system ground.
  2. USB Connection:

    • Connect the D+ and D- pins to the USB data lines.
    • Ensure that the USB connector is properly shielded and grounded.
  3. Parallel Interface:

    • Connect the 8-bit data bus (D0-D7) to your parallel interface.
    • Connect the control signals (e.g., /CS, /RD, /WR) as required by your application.
  4. Configuration:

    • Use the provided development tools and software to configure the device.
    • Load the appropriate firmware into the internal Flash memory.
  5. Firmware Update:

    • To update the firmware, connect the device to a PC via USB.
    • Use the CyLoader software or equivalent to upload new firmware.
  6. ESD Precautions:

    • Handle the device with care to avoid ESD damage.
    • Use proper ESD protection equipment and practices during handling and assembly.
  7. Temperature Considerations:

    • Ensure that the operating temperature remains within the specified range (-40°C to +85°C).
    • Provide adequate cooling if the device is expected to operate in high-temperature environments.
  8. Testing:

    • After assembly, test the device to ensure proper functionality.
    • Verify that all connections are secure and that the device is communicating correctly over USB.
  9. Documentation:

    • Refer to the datasheet and user manual for detailed information on pinout, timing diagrams, and programming guidelines.
(For reference only)

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