BUY 216-0707005 https://www.utsource.net/itm/p/1906341.html

216-0707005 is a BGA (Ball Grid Array) package manufactured by Texas Instruments. It is a 64-pin package with a 0.8mm pitch. The 216-0707005 package is designed for use with TI's OMAP-L138 digital signal processor (DSP). It is a low-power, high-performance processor designed for multimedia applications. It features two ARM9 cores, a C674x DSP core, and a variety of peripherals. The 216-0707005 package is designed for use in a wide range of applications, including medical imaging, industrial automation, automotive infotainment, and consumer electronics. It is also suitable for use in embedded systems and other applications that require high performance and low power consumption. (For reference only)