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IXFN48N50Q

Specifications

SKU: 1909427

BUY IXFN48N50Q https://www.utsource.net/itm/p/1909427.html
MOSFET N-CH 500V 48A SOT-227B
Parameter Symbol Value Unit
Maximum Drain Voltage VDS(max) 500 V
Maximum Gate-Source Voltage VGS(max) ±20 V
Continuous Drain Current ID (TC=25°C) 48 A
Continuous Drain Current ID (TC=100°C) 36 A
Pulse Drain Current IDM (TC=25°C) 144 A
Power Dissipation PTOT (TC=25°C) 1200 W
Junction Temperature TJ -55 to +175 °C
Storage Temperature TSTG -55 to +175 °C
Thermal Resistance, Junction to Case RθJC 0.3 °C/W

Instructions for Use:

  1. Handling Precautions:

    • Avoid exposing the device to temperatures outside the specified range.
    • Handle the device with care to prevent damage to the leads and body.
  2. Mounting:

    • Ensure proper heat sinking to maintain the junction temperature within safe limits.
    • Use a thermal interface material (TIM) between the device and the heatsink to improve thermal performance.
  3. Electrical Connections:

    • Connect the drain, source, and gate terminals correctly to avoid short circuits or incorrect operation.
    • Use appropriate wire gauges to handle the current ratings.
  4. Gate Drive:

    • Apply a gate voltage within the specified range to ensure reliable switching.
    • Use a gate resistor to control the switching speed and reduce electromagnetic interference (EMI).
  5. Overcurrent Protection:

    • Implement overcurrent protection to prevent damage from excessive currents.
    • Monitor the drain current and use a fast-acting fuse or circuit breaker if necessary.
  6. Testing:

    • Test the device under controlled conditions before integrating it into the final application.
    • Verify that all parameters are within the specified limits during testing.
  7. Storage:

    • Store the device in a dry, cool place away from direct sunlight and corrosive substances.
    • Follow the storage temperature guidelines to prevent degradation.
  8. Disposal:

    • Dispose of the device according to local regulations for electronic waste.
    • Recycle components where possible to minimize environmental impact.
(For reference only)

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