BUY 216-0774009 https://www.utsource.net/itm/p/1925952.html

216-0774009 is a BGA (Ball Grid Array) package from Texas Instruments. It is a 4x4mm, 0.5mm pitch, 24-pin package. The package is used for a variety of applications, including low-power, low-voltage applications such as digital signal processing, analog signal processing, and power management. It is also used for high-speed, high-performance applications such as microprocessors, microcontrollers, and memory devices. The package features a low profile, small form factor, and a high-density pin-out. It also has a high-reliability solder joint and a low thermal resistance. The package is RoHS compliant and lead-free. (For reference only)