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A3950SEUTR-T

Specifications

SKU: 4133672

BUY A3950SEUTR-T https://www.utsource.net/itm/p/4133672.html
Full-Bridge Motor Driver
Parameter Description Min Typ Max Unit
Supply Voltage (Vcc) Operating voltage range 4.5 - 55 V
Output Current (Iout) Continuous output current per channel - 1.2 2.0 A
Peak Output Current (Iout_peak) Peak output current per channel - - 3.0 A
Thermal Shutdown Temperature (TSD) Temperature at which the device shuts down to prevent damage - 170 - °C
Operating Temperature Range (Topr) Ambient temperature range for operation -40 - 125 °C
Storage Temperature Range (Tstg) Temperature range for storage -65 - 150 °C
Maximum Junction Temperature (Tj_max) Maximum allowable junction temperature - - 150 °C
Power Dissipation (Pd) Maximum power dissipation at Tc = 25°C - 18.5 - W
On-State Resistance (Ron) Resistance when the output is on - 1.5 - Ω
Off-State Leakage Current (Ileak) Leakage current when the output is off - 1 10 μA
Propagation Delay (tpd) Time delay between input and output change - 1.5 3.5 μs

Instructions for Using A3950SEUTR-T

  1. Supply Voltage:

    • Ensure the supply voltage (Vcc) is within the range of 4.5V to 55V to avoid damage or malfunction.
  2. Output Current:

    • The device can provide a continuous output current of up to 1.2A per channel, with a peak current capability of up to 3.0A. Do not exceed these limits to prevent overheating and potential failure.
  3. Thermal Management:

    • Monitor the device temperature to ensure it does not exceed 170°C, as this will trigger thermal shutdown to protect the device.
    • Keep the operating temperature within the range of -40°C to 125°C and store the device between -65°C and 150°C.
  4. Power Dissipation:

    • The maximum power dissipation at a case temperature of 25°C is 18.5W. Ensure adequate heat sinking if operating near this limit.
  5. On-State and Off-State Characteristics:

    • When the output is on, the on-state resistance (Ron) is typically 1.5Ω. When off, the leakage current (Ileak) should be kept below 10μA to minimize power loss.
  6. Propagation Delay:

    • The propagation delay (tpd) between input and output changes is typically 1.5μs and can vary between 1.5μs and 3.5μs. This should be considered in timing-sensitive applications.
  7. Handling and Storage:

    • Handle the device with care to avoid static discharge and physical damage.
    • Store the device in a dry environment within the specified temperature range to maintain its performance and reliability.
  8. Mounting and Soldering:

    • Follow recommended soldering profiles to ensure proper bonding and avoid thermal stress.
    • Use appropriate mounting techniques to ensure good thermal conductivity and mechanical stability.

By following these guidelines, you can ensure optimal performance and longevity of the A3950SEUTR-T device.

(For reference only)

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