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ADG432BNZ

Specifications

SKU: 4176689

BUY ADG432BNZ https://www.utsource.net/itm/p/4176689.html
SWITCH QUAD SPST 16DIP
Parameter Symbol Min Typ Max Unit Conditions
Supply Voltage VDD - VSS 2.7 - 15 V -
Digital Input Voltage VI -0.3 - VDD + 0.3 V -
Digital Output Voltage VO -0.3 - VDD + 0.3 V -
On-State Resistance RON 2.5 3.5 5.5 Ω VDD = 5 V, VSS = 0 V, TA = 25°C
Leakage Current ILK - - ±100 nA VDD = 15 V, VSS = 0 V, TA = 25°C
Breakdown Voltage VB - - 15 V -
Storage Temperature TSTG -65 - 150 °C -
Operating Temperature TA -40 - 85 °C -
Power Dissipation PD - - 710 mW TA = 25°C

Instructions for Use:

  1. Supply Voltage (VDD - VSS):

    • Ensure the supply voltage is within the range of 2.7 V to 15 V.
    • VSS is typically connected to ground (0 V).
  2. Digital Inputs (VI):

    • Digital input voltages should be between -0.3 V and VDD + 0.3 V.
    • Avoid exceeding these limits to prevent damage to the device.
  3. Digital Outputs (VO):

    • Digital output voltages should also be within the range of -0.3 V to VDD + 0.3 V.
  4. On-State Resistance (RON):

    • The on-state resistance is critical for ensuring low power loss when the switch is on.
    • At 5 V supply, the typical RON is 3.5 Ω, but it can vary from 2.5 Ω to 5.5 Ω.
  5. Leakage Current (ILK):

    • The leakage current should not exceed ±100 nA under normal operating conditions.
    • This parameter is important for minimizing power consumption in low-power applications.
  6. Breakdown Voltage (VB):

    • The device can withstand up to 15 V without breaking down.
    • Exceeding this voltage can cause permanent damage.
  7. Storage Temperature (TSTG):

    • Store the device in an environment where the temperature ranges from -65°C to 150°C.
    • Extreme temperatures can affect the performance and reliability of the device.
  8. Operating Temperature (TA):

    • The device is designed to operate in environments with temperatures ranging from -40°C to 85°C.
    • Operating outside this range can lead to reduced performance or failure.
  9. Power Dissipation (PD):

    • The maximum power dissipation at 25°C ambient temperature is 710 mW.
    • Ensure adequate heat sinking or cooling if the device is expected to dissipate significant power.
  10. Handling:

    • Handle the device with care to avoid static discharge.
    • Use proper ESD protection when handling the device to prevent damage.
  11. Mounting:

    • Follow recommended soldering and mounting procedures to ensure reliable operation.
    • Avoid excessive mechanical stress on the pins and package.
  12. Testing:

    • Test the device under specified conditions to verify its performance.
    • Refer to the datasheet for detailed test procedures and conditions.
(For reference only)

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