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Specifications
SKU: 4326687
CMOS AND GATES
| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Supply Voltage | VCC | 3 | - | 18 | V | Operating supply voltage range |
| Input High Level Voltage | VIH | 2 | - | VCC - 1.5 | V | Minimum input voltage to be recognized as high |
| Input Low Level Voltage | VIL | 0 | - | 1.5 | V | Maximum input voltage to be recognized as low |
| Output High Level Voltage | VOH | - | - | VCC - 0.5 | V | Minimum output voltage when high |
| Output Low Level Voltage | VOL | 0 | - | 0.5 | V | Maximum output voltage when low |
| Propagation Delay Time | tpd | - | 15 | 50 | ns | Time delay from input change to output change |
| Power Dissipation | PTOT | - | - | 100 | mW | Maximum power dissipation at 25°C ambient temperature |
| Operating Temperature Range | TA | -40 | - | 85 | °C | Ambient operating temperature range |
| Storage Temperature Range | TSTG | -65 | - | 150 | °C | Temperature range for storage |
Instructions for Use:
Supply Voltage:
- Ensure the supply voltage (VCC) is within the specified range of 3V to 18V.
- Connect VCC to the positive supply and GND to the ground.
Input Levels:
- Inputs should be kept within the valid voltage ranges for high (VIH) and low (VIL) levels.
- Avoid floating inputs; use pull-up or pull-down resistors if necessary.
Output Levels:
- The output high level (VOH) will be close to VCC minus a small voltage drop.
- The output low level (VOL) will be close to 0V.
Propagation Delay:
- Account for the propagation delay time (tpd) when designing circuits to ensure proper timing.
Power Dissipation:
- Do not exceed the maximum power dissipation (PTOT) to avoid overheating and potential damage.
Temperature Considerations:
- Operate the device within the specified ambient temperature range (TA).
- Store the device within the specified storage temperature range (TSTG).
Handling:
- Handle the device with care to avoid static discharge, which can damage sensitive components.
- Follow standard ESD (Electrostatic Discharge) precautions.
Mounting:
- Solder the device using recommended temperatures and times to avoid thermal stress.
- Ensure proper mechanical support and alignment during PCB assembly.
Inquiry - CD4073BM
