Share:


DG211CSE+

Specifications

SKU: 4383215

BUY DG211CSE+ https://www.utsource.net/itm/p/4383215.html
IC SWITCH QUAD SPST 16SOIC
Parameter Symbol Min Typ Max Unit Notes
Supply Voltage Vcc 4.5 5 5.5 V
Supply Current Icc - 0.6 1 mA
Input Voltage Range Vin 0 - Vcc V
Output Voltage Range Vout 0 - Vcc-0.2 V
On-State Resistance Ron - 1.5 3 Ω @ Vcc=5V, Vgs=5V, Id=10mA
Off-State Leakage Current Ioff - 1 10 nA @ Vcc=5V, Vgs=0V, Vds=5V
Switching Time (On) ton - 10 30 ns @ Vcc=5V, Vgs=5V, Id=10mA
Switching Time (Off) toff - 10 30 ns @ Vcc=5V, Vgs=0V, Id=10mA
Maximum Power Dissipation Pd - - 150 mW @ Ta=25°C
Operating Temperature Topr -40 - 85 °C
Storage Temperature Tstg -65 - 150 °C

Instructions:

  1. Supply Voltage (Vcc):

    • The DG211CSE+ operates within a supply voltage range of 4.5V to 5.5V. Ensure the power supply is stable and within this range to avoid damage.
  2. Input Voltage Range (Vin):

    • The input voltage should be between 0V and the supply voltage (Vcc). Exceeding these limits can cause malfunction or damage.
  3. Output Voltage Range (Vout):

    • The output voltage range is from 0V to Vcc - 0.2V. This ensures that the output remains within safe operating limits.
  4. On-State Resistance (Ron):

    • The on-state resistance is typically 1.5Ω at 5V supply and gate-source voltage. This value can help in calculating power dissipation and current flow when the switch is on.
  5. Off-State Leakage Current (Ioff):

    • When the switch is off, the leakage current should be kept below 10nA to minimize unwanted current flow.
  6. Switching Times (ton, toff):

    • The typical switching times for turning on and off are 10ns and 30ns, respectively. These values are important for high-speed applications.
  7. Maximum Power Dissipation (Pd):

    • The maximum power dissipation is 150mW at an ambient temperature of 25°C. Ensure proper heat dissipation if operating near this limit.
  8. Operating Temperature (Topr):

    • The device can operate within a temperature range of -40°C to 85°C. Ensure the environment does not exceed these limits.
  9. Storage Temperature (Tstg):

    • The storage temperature range is -65°C to 150°C. Store the device in a suitable environment to prevent damage.
  10. Handling Precautions:

    • Handle the device with care to avoid static discharge, which can damage the internal components.
    • Use appropriate ESD protection measures during handling and installation.
  11. Mounting:

    • Follow the recommended PCB layout and mounting guidelines to ensure reliable operation and thermal management.
  12. Testing:

    • Before final assembly, test the device under specified conditions to verify its performance and functionality.
(For reference only)

 Inquiry - DG211CSE+