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EPF10K20RC208-4N

Specifications

SKU: 4419332

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FLEX 10K FPGA 20K 208-RQFP
Parameter Description Value
Device Type Programmable Logic Device (PLD) EPF10K20RC208-4N
Family FLEX 10K Series
Package 208-Pin Fine Pitch Ball Grid Array (FBGA)
Operating Temperature Industrial Temperature Range -40°C to +85°C
Supply Voltage (VCC) Core Supply Voltage 3.3V
I/O Voltage Input/Output Supply Voltage 3.3V
Configuration Voltage Configuration Supply Voltage 3.3V
Configuration Method Active Serial (AS), Passive Serial (PS), JTAG
Number of Logic Cells Total Number of Logic Cells 20,000
Maximum User I/Os Maximum Number of User I/O Pins 172
Internal RAM (Kbits) Internal RAM Size 128 Kbits
Multiplier Blocks Number of Multiplier Blocks 4
Maximum Clock Frequency Maximum Clock Frequency for Logic Cells 167 MHz
Package Pin Pitch Pin Pitch of the Package 0.5 mm
Package Body Size Body Size of the Package 20 mm x 20 mm
Speed Grade Speed Grade of the Device -4

Instructions for Use

  1. Power Supply Connections:

    • Connect VCC (3.3V) to the appropriate power supply pins.
    • Ensure that the ground (GND) pins are connected to a stable ground.
  2. Configuration:

    • Choose a configuration method (Active Serial, Passive Serial, or JTAG).
    • Follow the specific configuration protocol for the chosen method.
    • Use the appropriate configuration software (e.g., Altera Quartus II).
  3. Programming:

    • Use a compatible programmer to load the design onto the device.
    • Ensure that the programming voltage (VPP) is correctly applied if required.
  4. Signal Integrity:

    • Use decoupling capacitors close to the power supply pins to minimize noise.
    • Route high-speed signals with controlled impedance to avoid reflections and crosstalk.
  5. Thermal Management:

    • Ensure adequate cooling if the device is operating at high temperatures or under heavy loads.
    • Consider using a heatsink if necessary.
  6. Storage and Handling:

    • Store the device in a dry, static-free environment.
    • Handle the device with ESD protection to prevent damage.
  7. Testing:

    • Verify the functionality of the device using a test bench or automated test equipment.
    • Check for proper configuration and operation of all I/O pins.

For detailed specifications and additional information, refer to the datasheet provided by the manufacturer.

(For reference only)

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