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GAL16LV8D-5LJ

Specifications

SKU: 4476427

BUY GAL16LV8D-5LJ https://www.utsource.net/itm/p/4476427.html
Low Voltage E2CMOS PLD Generic Array Logic
Parameter Description Value
Package Type Package Style 20-Pin PLCC
Operating Voltage (Vcc) Supply Voltage Range 3.3V to 5.5V
I/O Voltage (Vih, Vil) Input Voltage High/Low Vcc - 0.7V / 0.3V
Output Current (Ioh, Iol) Output Current High/Low ±10mA / ±20mA
Propagation Delay (tpd) Maximum Propagation Delay Time 10ns (max) at 5V
Power Consumption Quiescent Current (ICC) 10μA (max) at 5V
Operating Temperature Junction Temperature Range -40°C to +85°C
Storage Temperature Storage Temperature Range -65°C to +150°C
Programming Voltage Programming Voltage (VP) 12.6V (max)
Programming Current Programming Current (IP) 25mA (max)
Erase Time Typical Erase Time 10ms
Write Time Typical Write Time 10ms
Number of Inputs Number of Input Pins 8
Number of Outputs Number of Output Pins 8
Number of Macros Number of Macrocells 16
Fanout Maximum Fanout 10
ESD Protection Human Body Model (HBM) 2000V (min)

Instructions for GAL16LV8D-5LJ

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the range of 3.3V to 5.5V.
    • Connect the ground (GND) pin to a stable ground reference.
  2. Input and Output Handling:

    • Input voltages (Vih, Vil) should be within the specified range relative to Vcc.
    • Output pins can source or sink up to ±10mA/±20mA respectively.
  3. Programming:

    • Use a compatible programmer to program the device.
    • Apply the programming voltage (VP) of 12.6V (max) and ensure the programming current (IP) does not exceed 25mA.
    • Typical erase time is 10ms, and typical write time is 10ms.
  4. Temperature Considerations:

    • Operate the device within the junction temperature range of -40°C to +85°C.
    • Store the device within the storage temperature range of -65°C to +150°C.
  5. Handling and ESD:

    • Handle the device with care to avoid damage from electrostatic discharge (ESD).
    • The device has ESD protection rated at 2000V (min) according to the Human Body Model (HBM).
  6. Mounting and Soldering:

    • Follow standard surface mount technology (SMT) procedures for mounting the device.
    • Ensure proper soldering to all pins to maintain reliable electrical connections.
  7. Testing:

    • After programming and mounting, verify the functionality of the device by testing the input and output signals under normal operating conditions.
(For reference only)

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