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HN1C07F

Specifications

SKU: 4508224

BUY HN1C07F https://www.utsource.net/itm/p/4508224.html
NPN Silicon Epitaxial Transistor
Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VCC Operating 4.5 5.0 5.5 V
Output Current IO Continuous - 200 - mA
Quiescent Current IQ No Load - 0.5 - mA
Output Voltage Drop VDO IO = 200mA - 0.2 - V
Thermal Resistance θJA Free Air - 125 - °C/W
Operating Temperature TA Storage and Operation -40 - 85 °C

Instructions for HN1C07F

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 4.5V to 5.5V to avoid damage to the device.
    • Use a stable power source to maintain consistent performance.
  2. Output Current:

    • The maximum continuous output current (IO) is 200mA. Do not exceed this limit to prevent overheating and potential failure.
    • If higher currents are required, consider using additional current-limiting components or a different device.
  3. Quiescent Current:

    • The quiescent current (IQ) is typically 0.5mA with no load. This should be accounted for in power budget calculations.
  4. Output Voltage Drop:

    • At the maximum output current (200mA), the output voltage drop (VDO) is typically 0.2V. This may affect the output voltage regulation, especially in low-voltage applications.
  5. Thermal Management:

    • The thermal resistance (θJA) is 125°C/W. Ensure adequate heat dissipation to keep the junction temperature within safe limits, especially under high current conditions.
    • Consider using a heatsink if the device will operate near its maximum current or in high ambient temperatures.
  6. Operating Temperature:

    • The operating temperature range (TA) is from -40°C to 85°C. Ensure the device is used within this range to maintain reliability and performance.
    • Avoid exposing the device to extreme temperatures outside this range, as it can lead to reduced lifespan and potential failure.
  7. Storage:

    • Store the device in a dry, cool environment to prevent moisture damage and ensure long-term reliability.
    • Follow proper ESD (Electrostatic Discharge) precautions when handling the device to avoid damage.
  8. Mounting:

    • Follow recommended soldering profiles and PCB layout guidelines to ensure reliable mounting and operation.
    • Avoid mechanical stress on the leads and body of the device during assembly and use.
(For reference only)

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