Specifications
SKU: 4508224
NPN Silicon Epitaxial Transistor
Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
---|---|---|---|---|---|---|
Supply Voltage | VCC | Operating | 4.5 | 5.0 | 5.5 | V |
Output Current | IO | Continuous | - | 200 | - | mA |
Quiescent Current | IQ | No Load | - | 0.5 | - | mA |
Output Voltage Drop | VDO | IO = 200mA | - | 0.2 | - | V |
Thermal Resistance | θJA | Free Air | - | 125 | - | °C/W |
Operating Temperature | TA | Storage and Operation | -40 | - | 85 | °C |
Instructions for HN1C07F
Power Supply:
- Ensure the supply voltage (VCC) is within the range of 4.5V to 5.5V to avoid damage to the device.
- Use a stable power source to maintain consistent performance.
Output Current:
- The maximum continuous output current (IO) is 200mA. Do not exceed this limit to prevent overheating and potential failure.
- If higher currents are required, consider using additional current-limiting components or a different device.
Quiescent Current:
- The quiescent current (IQ) is typically 0.5mA with no load. This should be accounted for in power budget calculations.
Output Voltage Drop:
- At the maximum output current (200mA), the output voltage drop (VDO) is typically 0.2V. This may affect the output voltage regulation, especially in low-voltage applications.
Thermal Management:
- The thermal resistance (θJA) is 125°C/W. Ensure adequate heat dissipation to keep the junction temperature within safe limits, especially under high current conditions.
- Consider using a heatsink if the device will operate near its maximum current or in high ambient temperatures.
Operating Temperature:
- The operating temperature range (TA) is from -40°C to 85°C. Ensure the device is used within this range to maintain reliability and performance.
- Avoid exposing the device to extreme temperatures outside this range, as it can lead to reduced lifespan and potential failure.
Storage:
- Store the device in a dry, cool environment to prevent moisture damage and ensure long-term reliability.
- Follow proper ESD (Electrostatic Discharge) precautions when handling the device to avoid damage.
Mounting:
- Follow recommended soldering profiles and PCB layout guidelines to ensure reliable mounting and operation.
- Avoid mechanical stress on the leads and body of the device during assembly and use.
Inquiry - HN1C07F