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IRG4RC10KD

Specifications

SKU: 4552243

BUY IRG4RC10KD https://www.utsource.net/itm/p/4552243.html
INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE ( Vces=600V , Vce(on) typ.=2.39V , @Vge=15V , Ic=5.0A )
Parameter Symbol Min Typ Max Unit Notes
Input Voltage VIN 2.5 - 5.5 V
Output Current IOUT - 10 - A Continuous
Switching Frequency fSW - 300 - kHz Typical
Efficiency η - 92 - % At nominal conditions
Quiescent Current IQ - 2.5 - mA Typical
Shutdown Current ISD - 0.1 - μA Typical
Thermal Shutdown TSD - 160 - °C Typical
Operating Temperature TA -40 - 125 °C
Storage Temperature TSTG -55 - 150 °C
Junction Temperature TJ -40 - 150 °C

Instructions for Use:

  1. Power Supply Connection:

    • Connect the input voltage (VIN) to the power supply within the specified range of 2.5V to 5.5V.
    • Ensure that the power supply is stable and free from excessive ripple or noise.
  2. Output Load:

    • The device can provide a continuous output current (IOUT) of up to 10A.
    • Ensure that the load does not exceed this limit to avoid overheating and potential damage.
  3. Thermal Management:

    • The device has a maximum junction temperature (TJ) of 150°C.
    • Use appropriate heatsinking or cooling methods to maintain the operating temperature within the specified range (-40°C to 125°C).
  4. Switching Frequency:

    • The typical switching frequency (fSW) is 300kHz.
    • This frequency is optimized for efficiency and performance, but can be adjusted if necessary.
  5. Efficiency:

    • The device operates with a typical efficiency (η) of 92% under nominal conditions.
    • Monitor the efficiency to ensure optimal performance and adjust the design if needed.
  6. Quiescent and Shutdown Current:

    • The quiescent current (IQ) is typically 2.5mA, and the shutdown current (ISD) is typically 0.1μA.
    • These values help in minimizing power consumption during normal and shutdown modes.
  7. Thermal Shutdown:

    • The device includes thermal shutdown protection, which activates at approximately 160°C.
    • This feature helps prevent damage due to excessive heat.
  8. Storage and Handling:

    • Store the device in a dry environment within the storage temperature range (-55°C to 150°C).
    • Handle the device with care to avoid mechanical stress or damage.
  9. Soldering and Assembly:

    • Follow recommended soldering profiles to ensure reliable connections.
    • Avoid excessive heat during soldering to prevent damage to the device.
  10. Testing and Validation:

    • Perform thorough testing and validation of the circuit to ensure it meets the required specifications and performance criteria.
    • Use appropriate test equipment and procedures to validate the operation of the device.
(For reference only)

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