Specifications
SKU: 4614748
DRIVER HI/LO SIDE HV 8-SOIC
Parameter | Symbol | Min | Typ | Max | Unit | Description |
---|---|---|---|---|---|---|
Supply Voltage | VCC | 4.5 | - | 24 | V | Operating supply voltage range |
Quiescent Current | IQ | - | 0.5 | - | mA | Quiescent current at VCC = 12V |
Output Current (Max) | IO | - | - | 1.5 | A | Maximum continuous output current |
Output Voltage Drop | VDROP | - | 0.7 | - | V | Voltage drop across the output when IO = 1.5A |
Thermal Shutdown | TSD | - | 160 | - | °C | Temperature at which thermal shutdown occurs |
Operating Temperature | TA | -40 | - | 125 | °C | Ambient operating temperature range |
Storage Temperature | TSTG | -65 | - | 150 | °C | Storage temperature range |
Junction-to-Ambient Thermal Resistance | RθJA | - | 50 | - | °C/W | Thermal resistance from junction to ambient |
Instructions for Use
Supply Voltage:
- Ensure the supply voltage is within the range of 4.5V to 24V to avoid damage or improper operation.
Quiescent Current:
- The quiescent current is typically 0.5mA at a supply voltage of 12V. This should be considered when designing the power supply circuit to ensure efficient power usage.
Output Current:
- The maximum continuous output current is 1.5A. Exceeding this value can cause overheating and potential damage to the device.
Output Voltage Drop:
- When the output current is at its maximum (1.5A), the voltage drop across the output is approximately 0.7V. This should be accounted for in the circuit design to ensure the load receives the required voltage.
Thermal Shutdown:
- The device will enter thermal shutdown if the junction temperature reaches 160°C. Ensure proper heat sinking or cooling mechanisms are in place to prevent this.
Operating Temperature:
- The device can operate in ambient temperatures ranging from -40°C to 125°C. Ensure the operating environment does not exceed these limits.
Storage Temperature:
- Store the device in temperatures ranging from -65°C to 150°C to prevent damage during storage.
Junction-to-Ambient Thermal Resistance:
- The thermal resistance from the junction to the ambient is 50°C/W. This value is important for calculating the required heat sink size to maintain safe operating temperatures.
Mounting:
- Mount the device on a PCB with appropriate thermal management techniques, such as using a heat sink or thermal vias, to dissipate heat effectively.
Electrostatic Discharge (ESD) Protection:
- Handle the device with ESD precautions to avoid damage from static electricity.
Soldering:
- Follow recommended soldering profiles to avoid thermal stress that could damage the device.
Inquiry - L6385ED013TR