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LTC1624CS8#TRPBF

Specifications

SKU: 4788503

BUY LTC1624CS8#TRPBF https://www.utsource.net/itm/p/4788503.html
IC REG CTRLR BCK/BST/SEPIC 8SOIC
Parameter Symbol Conditions Min Typical Max Unit
Supply Voltage VCC Operating Range 2.7 - 5.5 V
Output Voltage Range VOUT Relative to VREF -0.1 - VCC + 0.1 V
Reference Voltage VREF Internal 2.048 - 2.048 V
Differential Nonlinearity (DNL) DNL ±LSB -1 0 +1 LSB
Integral Nonlinearity (INL) INL ±LSB -1 0 +1 LSB
Output Settling Time tSETTLE 10-bit, 0.1% - 30 - μs
Power Consumption ICC All outputs at mid-scale 1.2 - 1.5 mA
Output Current IOUT Per Channel -10 - 10 mA

Instructions for Use

  1. Power Supply:

    • Connect the supply voltage (VCC) within the range of 2.7V to 5.5V.
    • Ensure a stable power supply to avoid fluctuations that could affect the performance of the DAC.
  2. Reference Voltage:

    • The internal reference voltage is 2.048V. If an external reference is used, ensure it is within the specified range and stable.
  3. Output Configuration:

    • The output voltage (VOUT) can be set relative to the reference voltage (VREF).
    • The output range is from -0.1V to VCC + 0.1V.
  4. DNL and INL:

    • The differential nonlinearity (DNL) and integral nonlinearity (INL) are specified to ensure accurate conversion.
    • These parameters should be within ±1 LSB for optimal performance.
  5. Settling Time:

    • The output settling time is typically 30 μs for a 10-bit resolution to within 0.1% of the final value.
    • Ensure that the system allows sufficient time for the output to settle before reading or using the value.
  6. Power Consumption:

    • The typical power consumption is 1.2 mA when all outputs are at mid-scale.
    • Ensure the power supply can handle the current requirements.
  7. Output Current:

    • Each output channel can source or sink up to 10 mA.
    • Avoid exceeding this limit to prevent damage to the device.
  8. General Handling:

    • Handle the device with care to avoid static discharge which can damage the sensitive components.
    • Follow proper PCB layout guidelines to minimize noise and interference.
  9. Programming:

    • Refer to the datasheet for specific programming instructions and communication protocols (e.g., SPI, I2C).
    • Ensure the correct configuration of control pins and registers for desired operation.

For detailed information and specific applications, refer to the full datasheet provided by the manufacturer.

(For reference only)

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