Specifications
SKU: 4810341
IC OSC SILICON PROG TSOT23-5
Parameter | Symbol | Min | Typical | Max | Unit |
---|---|---|---|---|---|
Input Voltage Range | VIN | 2.7 | - | 5.5 | V |
Output Voltage Range | VOUT | 0.8 | - | 5.0 | V |
Output Current | IOUT | - | 300 | 500 | mA |
Quiescent Current | IQ | - | 45 | - | μA |
Shutdown Current | ISD | - | 1 | - | μA |
Load Regulation | - | - | 0.5 | - | % |
Line Regulation | - | - | 0.05 | - | %/V |
Dropout Voltage | VDROP | - | 150 | - | mV |
Operating Temperature | TOP | -40 | - | 125 | °C |
Storage Temperature | TSTG | -65 | - | 150 | °C |
Instructions for Use
Input Voltage (VIN):
- Ensure the input voltage is within the specified range of 2.7V to 5.5V.
- Connect the input voltage to the VIN pin and ground to the GND pin.
Output Voltage (VOUT):
- The output voltage can be set using external resistors. Refer to the datasheet for specific resistor values.
- Connect the output load between the VOUT pin and ground.
Output Current (IOUT):
- The device can provide up to 500mA of output current, with typical performance at 300mA.
- Ensure the load does not exceed the maximum output current to avoid damage.
Quiescent Current (IQ):
- The quiescent current is typically 45μA, which helps in maintaining low power consumption.
Shutdown Mode:
- To put the device into shutdown mode, apply a low signal to the SHDN pin. The shutdown current is typically 1μA.
- To activate the device, apply a high signal to the SHDN pin.
Load and Line Regulation:
- The load regulation is typically 0.5%, ensuring stable output under varying load conditions.
- The line regulation is typically 0.05% per volt, maintaining output stability with changes in input voltage.
Dropout Voltage:
- The dropout voltage is typically 150mV, allowing the device to operate efficiently even when the input voltage is close to the output voltage.
Operating and Storage Temperature:
- The operating temperature range is from -40°C to 125°C.
- The storage temperature range is from -65°C to 150°C.
PCB Layout:
- Ensure proper PCB layout to minimize noise and parasitic effects. Place bypass capacitors close to the VIN and GND pins.
Thermal Considerations:
- If the device is expected to dissipate significant power, ensure adequate heat sinking or thermal management to keep the junction temperature within safe limits.
Inquiry - LTC1799CS5#TRPBF