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LTC1799CS5#TRPBF

Specifications

SKU: 4810341

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IC OSC SILICON PROG TSOT23-5
Parameter Symbol Min Typical Max Unit
Input Voltage Range VIN 2.7 - 5.5 V
Output Voltage Range VOUT 0.8 - 5.0 V
Output Current IOUT - 300 500 mA
Quiescent Current IQ - 45 - μA
Shutdown Current ISD - 1 - μA
Load Regulation - - 0.5 - %
Line Regulation - - 0.05 - %/V
Dropout Voltage VDROP - 150 - mV
Operating Temperature TOP -40 - 125 °C
Storage Temperature TSTG -65 - 150 °C

Instructions for Use

  1. Input Voltage (VIN):

    • Ensure the input voltage is within the specified range of 2.7V to 5.5V.
    • Connect the input voltage to the VIN pin and ground to the GND pin.
  2. Output Voltage (VOUT):

    • The output voltage can be set using external resistors. Refer to the datasheet for specific resistor values.
    • Connect the output load between the VOUT pin and ground.
  3. Output Current (IOUT):

    • The device can provide up to 500mA of output current, with typical performance at 300mA.
    • Ensure the load does not exceed the maximum output current to avoid damage.
  4. Quiescent Current (IQ):

    • The quiescent current is typically 45μA, which helps in maintaining low power consumption.
  5. Shutdown Mode:

    • To put the device into shutdown mode, apply a low signal to the SHDN pin. The shutdown current is typically 1μA.
    • To activate the device, apply a high signal to the SHDN pin.
  6. Load and Line Regulation:

    • The load regulation is typically 0.5%, ensuring stable output under varying load conditions.
    • The line regulation is typically 0.05% per volt, maintaining output stability with changes in input voltage.
  7. Dropout Voltage:

    • The dropout voltage is typically 150mV, allowing the device to operate efficiently even when the input voltage is close to the output voltage.
  8. Operating and Storage Temperature:

    • The operating temperature range is from -40°C to 125°C.
    • The storage temperature range is from -65°C to 150°C.
  9. PCB Layout:

    • Ensure proper PCB layout to minimize noise and parasitic effects. Place bypass capacitors close to the VIN and GND pins.
  10. Thermal Considerations:

    • If the device is expected to dissipate significant power, ensure adequate heat sinking or thermal management to keep the junction temperature within safe limits.
(For reference only)

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