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ST72681/R21

Specifications

SKU: 5201111

BUY ST72681/R21 https://www.utsource.net/itm/p/5201111.html
USB 2.0 high-speed Flash drive controller
Parameter Symbol Min Typ Max Unit Description
Supply Voltage VCC 2.0 3.3 5.5 V Operating voltage range
Operating Temperature TOP -40 - 85 °C Temperature range for operation
Storage Temperature TSTG -65 - 150 °C Temperature range for storage
Input Current IIN - 10 30 μA Typical input current at VCC = 3.3V
Output Current per Pin IO - 20 25 mA Maximum output current per pin
Total Output Current ITOT - 100 150 mA Maximum total output current
Output Leakage Current IOL - 1 5 μA Leakage current at VCC = 5.5V
Input Voltage Range VI 0 - VCC V Valid input voltage range
Propagation Delay Time tpd 5 10 15 ns Propagation delay time at VCC = 5V
Power Dissipation PD - - 600 mW Maximum power dissipation
ESD Rating HBM - - 2000 V Human Body Model (HBM) ESD protection

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage is within the specified range (2.0V to 5.5V).
    • Use a stable power source to avoid fluctuations that could affect performance.
  2. Temperature Considerations:

    • Operate the device within the temperature range of -40°C to 85°C.
    • Store the device within the temperature range of -65°C to 150°C.
  3. Current Handling:

    • Do not exceed the maximum output current per pin (25mA) or the total output current (150mA).
    • Ensure the input current does not exceed 30μA to prevent damage.
  4. Input and Output Voltage:

    • The input voltage should be within the range of 0V to VCC.
    • Ensure the output leakage current is kept below 5μA to maintain proper functionality.
  5. Timing:

    • The propagation delay time is typically 10ns at VCC = 5V. Design your circuits to account for this delay.
  6. Power Dissipation:

    • The maximum power dissipation is 600mW. Ensure adequate heat dissipation if operating near this limit.
  7. ESD Protection:

    • The device has a Human Body Model (HBM) ESD rating of 2000V. Handle the device with care to avoid static discharge.
  8. Mounting and Handling:

    • Follow standard handling procedures for sensitive electronic components.
    • Mount the device on a PCB using recommended soldering techniques to ensure reliable connections.
  9. Testing:

    • Before final assembly, test the device under typical operating conditions to ensure it meets all specifications.
  10. Compliance:

    • Ensure the device complies with all relevant safety and regulatory standards for your application.
(For reference only)

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