Instructions:

1. Handling and Storage:

   • Store the device in a dry, cool place to avoid moisture and temperature extremes.
   • Handle with care to prevent static discharge and physical damage.

2. Mounting and Soldering:

   • Ensure proper heat sinking to manage the junction temperature.
   • Use a soldering iron with a temperature not exceeding 260°C for a maximum of 10 seconds per connection.
   • Avoid applying excessive mechanical stress to the leads during soldering.

3. Electrical Connections:

   • Connect the device according to the circuit diagram provided in the application note.
   • Ensure that the reverse voltage does not exceed the maximum rating (100V) to prevent breakdown.
   • Use appropriate current limiting resistors or circuits to protect against overcurrent conditions.

4. Thermal Management:

   • Monitor the junction temperature to ensure it does not exceed 150°C.
   • Use thermal paste or thermal pads to improve heat dissipation if necessary.

5. Testing and Operation:

   • Test the device under controlled conditions before integrating it into the final application.
   • Regularly inspect the device for signs of wear or damage, especially in high-reliability applications.

For detailed application notes and further information, refer to the official STMicroelectronics documentation for the STPS20S100CFP.