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TC58FVM6B5BTG65

Specifications

SKU: 5249340

BUY TC58FVM6B5BTG65 https://www.utsource.net/itm/p/5249340.html
FLASH 64MBIT 65NS 48TSOP
Parameter Description Value
Device Type NAND Flash Memory -
Memory Density 64 Gb (8 GB) -
Number of Dies 1 Die -
Interface Toggle Mode 2.0 -
I/O Voltage (VCCQ) Supply Voltage for I/Os 1.8 V ± 0.1 V
Core Voltage (VCC) Supply Voltage for Core 3.3 V ± 0.3 V
Data I/Os Number of Data I/O Pins 8
Package Package Type BGA-169
Operating Temperature Industrial Temperature Range -40°C to +85°C
Programming Voltage (VPP) Programming Voltage Not Required (Internal)
Read/Write Speed Read/Write Performance Up to 400 MB/s (Read), Up to 200 MB/s (Write)
Erase Block Size Block Size for Erase Operation 256 KB
Page Size Page Size for Read/Write Operations 8 KB (Data) + 448 Bytes (Spare Area)
Endurance Program/Erase Cycles 3,000 Cycles (Typical)
Retention Data Retention 10 Years at 25°C
Package Dimensions Physical Size 11.5 mm × 16 mm × 1.2 mm
RoHS Compliance Environmental Compliance Yes

Instructions:

  1. Power Supply:

    • Connect VCCQ to 1.8 V ± 0.1 V.
    • Connect VCC to 3.3 V ± 0.3 V.
  2. Signal Levels:

    • All I/O signals should be compatible with 1.8 V logic levels.
    • Ensure proper pull-up or pull-down resistors are used for control signals as required.
  3. Initialization:

    • After power-up, wait for the device to complete its internal initialization sequence before issuing any commands.
    • Use the READ ID command (0x90) to verify the device is properly initialized.
  4. Command Sequence:

    • Refer to the command table in the datasheet for specific command sequences.
    • Common commands include READ (0x00), PROGRAM (0x80), ERASE (0x60), and STATUS READ (0x70).
  5. Programming and Erasing:

    • Use the PROGRAM command to write data to a page.
    • Use the ERASE command to erase a block.
    • Ensure that the block is not being read or written to during the erase operation.
  6. Error Handling:

    • Check the status register after each command to ensure successful execution.
    • Handle errors such as write protect, device busy, and program/erase failures appropriately.
  7. Data Integrity:

    • Use the ECC (Error Correction Code) features provided by the device to ensure data integrity.
    • Implement ECC algorithms in your system if not using a controller that supports ECC.
  8. Thermal Management:

    • Ensure adequate cooling for the device, especially during high-speed read/write operations.
    • Monitor the temperature and avoid operating the device outside its specified temperature range.
  9. Storage:

    • Store the device in a dry, cool environment to prevent moisture damage.
    • Follow ESD (Electrostatic Discharge) precautions when handling the device.
  10. Documentation:

    • Refer to the datasheet and application notes for detailed information on advanced features and troubleshooting.
(For reference only)

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