Share:


TLP352

Specifications

SKU: 5300257

BUY TLP352 https://www.utsource.net/itm/p/5300257.html

Parameter Symbol Min Typ Max Unit Conditions
Forward Voltage (IF = 10 mA) VF - 1.2 1.6 V -
Peak Forward Current IF(PK) - - 30 mA Pulse Width ≤ 1 ms, Duty Cycle ≤ 1%
Continuous Forward Current IF - - 10 mA -
Reverse Voltage VR - - 5 V -
Output Current (VO = 5 V, RL = 500 Ω) IC 0.5 1.0 - mA -
Turn-On Time (VI = 5 V, RL = 500 Ω) ton - 10 30 μs -
Turn-Off Time (VI = 5 V, RL = 500 Ω) toff - 10 30 μs -
Isolation Voltage VIORM - - 5000 Vrms 1 minute, 50/60 Hz
Operating Temperature Range TA -40 - 85 °C -
Storage Temperature Range TSTG -40 - 100 °C -

Instructions for Using TLP352:

  1. Forward Current (IF):

    • Ensure that the forward current does not exceed 10 mA continuously.
    • For pulse applications, the peak forward current can be up to 30 mA, but ensure the pulse width is ≤ 1 ms and the duty cycle is ≤ 1%.
  2. Reverse Voltage (VR):

    • The device should not be subjected to reverse voltages greater than 5 V.
  3. Output Current (IC):

    • The output current should be between 0.5 mA and 1.0 mA when the output voltage is 5 V and the load resistance is 500 Ω.
  4. Turn-On and Turn-Off Times:

    • The turn-on and turn-off times are typically 10 μs but can range up to 30 μs under the specified conditions.
  5. Isolation Voltage:

    • The device provides an isolation voltage of 5000 Vrms for 1 minute at 50/60 Hz.
  6. Temperature Ranges:

    • The operating temperature range is from -40°C to 85°C.
    • The storage temperature range is from -40°C to 100°C.
  7. Handling Precautions:

    • Handle the device with care to avoid static discharge, which can damage the internal components.
    • Ensure proper heat sinking if the device is used in high-current or high-temperature applications.
  8. Mounting:

    • Follow the recommended PCB layout and mounting guidelines to ensure optimal performance and reliability.
    • Use appropriate soldering techniques and temperatures to avoid thermal stress on the device.
  9. Testing:

    • Before finalizing the design, perform thorough testing under various operating conditions to ensure the device meets the required specifications.
(For reference only)

 Inquiry - TLP352