Instructions for Use:

1. Supply Voltage (VDD):

   • Ensure the supply voltage is within the range of 2.7V to 5.5V to avoid damage to the device.

2. Operating Temperature (Toper):

   • The device is designed to operate within the temperature range of -40°C to 85°C. Ensure that the ambient temperature does not exceed these limits.

3. Storage Temperature (Tstg):

   • Store the device in an environment where the temperature ranges from -65°C to 150°C to prevent degradation.

4. Output Current (IOUT and IPEAK):

   • The continuous output current per channel should not exceed 50mA. For pulse applications, the peak output current can go up to 100mA with a pulse width less than 1ms and a duty cycle less than 2%.

5. Power Dissipation (PD):

   • The maximum power dissipation at room temperature (25°C) is 700mW. Ensure adequate heat sinking if operating near this limit.

6. Thermal Resistance (θJA):

   • The thermal resistance from junction to ambient is 90°C/W. Proper cooling solutions may be required for high-power applications.

7. Input Capacitance (CIN):

   • The input capacitance is typically 10pF at 5V and 1MHz. This value should be considered when designing the input circuitry.

8. Output Leakage Current (IOL):

   • The output leakage current is typically 1μA and can go up to 5μA at 5V and 0V output.

9. Output Voltage Levels (VOH and VOL):

   • The output high level voltage (VOH) is at least 4.2V when the output current is -10mA.
   • The output low level voltage (VOL) is at most 0.4V when the output current is 10mA.

10. Propagation Delay Time (tpd):

    • The propagation delay time is typically 10ns at 5V and a load capacitance of 15pF.

Additional Notes:

• Always refer to the datasheet for the most accurate and detailed information.
• Ensure proper PCB layout and grounding to minimize noise and improve performance.
• Use appropriate decoupling capacitors close to the power pins to stabilize the supply voltage.