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TPIC6C595DR

Specifications

SKU: 5313593

BUY TPIC6C595DR https://www.utsource.net/itm/p/5313593.html
POWER LOGIC 8-BIT SHIFT REGISTER
Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VCC Operating 4.5 - 5.5 V
Output Current per Pin IO Continuous - - 35 mA
Peak Output Current per Pin IOPK Pulse Width ≤ 100 μs - - 50 mA
Total Output Current ITOT All Outputs On - - 70 mA
Input Voltage (High) VIH Input Current = 1 μA 2.0 - - V
Input Voltage (Low) VIL Input Current = -1 μA - - 0.8 V
Propagation Delay Time tpd VCC = 5V, TA = 25°C 40 - 70 ns
Power Dissipation PD Maximum - - 660 mW
Operating Temperature Range TA - -40 - 85 °C
Storage Temperature Range TSTG - -65 - 150 °C

Instructions for Using TPIC6C595DR

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 4.5V to 5.5V.
    • Use a stable power source to avoid voltage fluctuations that could affect performance.
  2. Output Current:

    • Do not exceed the continuous output current (IO) of 35mA per pin.
    • For pulse applications, the peak output current (IOPK) can be up to 50mA for pulses ≤ 100 μs.
    • The total output current (ITOT) should not exceed 70mA when all outputs are active.
  3. Input Levels:

    • Ensure input voltages meet the specified levels: VIH ≥ 2.0V for logic high and VIL ≤ 0.8V for logic low.
  4. Propagation Delay:

    • The propagation delay time (tpd) is typically between 40ns and 70ns at VCC = 5V and TA = 25°C. This is important for timing considerations in your circuit design.
  5. Thermal Management:

    • The maximum power dissipation (PD) is 660mW. Ensure adequate heat sinking or cooling if operating near this limit.
    • The operating temperature range (TA) is from -40°C to 85°C. Avoid exposing the device to temperatures outside this range.
    • The storage temperature range (TSTG) is from -65°C to 150°C. Store the device in a controlled environment to prevent damage.
  6. Handling:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Follow proper soldering techniques to ensure reliable connections and prevent thermal stress.
  7. Testing:

    • Before integrating the TPIC6C595DR into your final design, test it in a controlled environment to verify its performance and reliability.

By following these parameters and instructions, you can ensure optimal performance and longevity of the TPIC6C595DR in your application.

(For reference only)

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