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TPS2159IDGN

Specifications

SKU: 5315683

BUY TPS2159IDGN https://www.utsource.net/itm/p/5315683.html
3.3-V LDO AND DUAL SWITCH FOR USB BUS-POWERED HUB POWER MANAGEMENT
Parameter Symbol Min Typ Max Unit Conditions
Input Voltage VIN 2.7 - 5.5 V
Output Voltage VOUT 0 - VIN V
Continuous Current IOUT - 1.5 3 A
Peak Current IPEAK - 4 6 A
Quiescent Current IQ - 25 50 μA VIN = 5V
Turn-On Time tON - 100 150 μs
Turn-Off Time tOFF - 10 20 μs
Thermal Shutdown TSD - 160 170 °C
Operating Temperature TOPR -40 - 85 °C
Storage Temperature TSTG -65 - 150 °C

Instructions for Using TPS2159IDGN

  1. Power Supply Connection:

    • Connect the input voltage (VIN) to the power supply within the specified range of 2.7V to 5.5V.
    • Ensure the output voltage (VOUT) is connected to the load.
  2. Current Limiting:

    • The device supports continuous current up to 3A and peak current up to 6A. Monitor the load to avoid exceeding these limits to prevent damage.
  3. Thermal Management:

    • The device has a thermal shutdown feature that activates at temperatures between 160°C and 170°C. Ensure adequate heat dissipation to keep the device within the operating temperature range (-40°C to 85°C).
  4. Turn-On and Turn-Off Times:

    • The turn-on time is typically 100μs, and the turn-off time is around 10μs. These times should be considered when designing circuits that require precise timing.
  5. Quiescent Current:

    • The quiescent current is typically 25μA at 5V input. This is important for low-power applications to minimize power consumption.
  6. Storage and Handling:

    • Store the device in a temperature range of -65°C to 150°C. Follow proper ESD (Electrostatic Discharge) handling procedures to prevent damage.
  7. Schematic and Layout Considerations:

    • Use a clear and concise layout to minimize parasitic inductance and capacitance. Place decoupling capacitors close to the power pins to ensure stable operation.
  8. Testing and Validation:

    • Before deploying the device in a final application, perform thorough testing under various conditions to ensure reliability and performance.

For more detailed information, refer to the datasheet and application notes provided by Texas Instruments.

(For reference only)

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