Share:


UZM27FBT1

Specifications

SKU: 5376144

BUY UZM27FBT1 https://www.utsource.net/itm/p/5376144.html

Parameter Symbol Min Typical Max Unit Conditions
Supply Voltage Vcc 4.5 - 5.5 V
Output Current (Max) Iout - 500 - mA Continuous
Quiescent Current Iq - 1.5 - mA Vcc = 5V
Operating Temperature Topr -40 - 85 °C
Storage Temperature Tstg -65 - 150 °C
Input Voltage Range Vin 0 - 5.5 V
Output Voltage Drop Vsat - 0.4 - V Iout = 500mA, Vcc = 5V
Thermal Resistance (θJA) θJA - 65 - °C/W Free Air

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the range of 4.5V to 5.5V.
    • Connect the power supply to the Vcc pin and ground (GND) pin.
  2. Output Configuration:

    • The maximum continuous output current (Iout) is 500mA. Do not exceed this limit to avoid damage.
    • Connect the load to the output (OUT) pin and ground (GND).
  3. Quiescent Current:

    • The quiescent current (Iq) is typically 1.5mA at Vcc = 5V. This is the current consumed by the device when no load is connected.
  4. Temperature Considerations:

    • The operating temperature (Topr) should be between -40°C and 85°C.
    • The storage temperature (Tstg) should be between -65°C and 150°C.
  5. Input Voltage:

    • The input voltage (Vin) should be within the range of 0V to 5.5V to ensure proper operation.
  6. Output Voltage Drop:

    • The output voltage drop (Vsat) is typically 0.4V when the output current is 500mA and Vcc is 5V. This should be considered when designing the circuit to ensure the output voltage meets the required specifications.
  7. Thermal Management:

    • The thermal resistance (θJA) is 65°C/W in free air. Proper heat dissipation may be required if the device is operated at high currents or in high ambient temperatures.
  8. Handling and Storage:

    • Store the device in a dry, cool place to prevent damage from moisture and extreme temperatures.
    • Handle the device with care to avoid static discharge, which can damage sensitive components.
  9. Mounting:

    • Follow the recommended PCB layout guidelines provided by the manufacturer to ensure optimal performance and reliability.
    • Ensure proper soldering techniques are used to avoid cold solder joints and other issues that can affect performance.
(For reference only)

 Inquiry - UZM27FBT1