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XR16C2850CM

Specifications

SKU: 5412697

BUY XR16C2850CM https://www.utsource.net/itm/p/5412697.html
DUAL UART WITH 128-byte FIFO’s AND RS-485 HALF DUPLEX CONTROL
Parameter Symbol Min Typ Max Unit
Supply Voltage Vcc 4.75 5.0 5.25 V
Operating Temperature Toper -40 85 °C
Storage Temperature Tstg -65 150 °C
Maximum Output Current Iout 20 30 mA
Input Leakage Current IIH 1 10 μA
Output Low Voltage VOL 0 0.4 0.5 V
Output High Voltage VOH 4.5 4.7 5.0 V
Propagation Delay Time tpd 5 10 15 ns
Power Dissipation PD 100 200 mW
Static Current ICC 10 20 μA

Instructions for Using XR16C2850CM

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the range of 4.75V to 5.25V.
    • Use appropriate decoupling capacitors (e.g., 0.1μF ceramic capacitor) close to the Vcc and GND pins to stabilize the power supply.
  2. Temperature Range:

    • The device operates within -40°C to 85°C. Store the device between -65°C and 150°C.
  3. Current Handling:

    • The maximum output current (Iout) is 30mA. Ensure that the load does not exceed this limit to avoid damage.
    • For higher currents, consider using external drivers or transistors.
  4. Input and Output Levels:

    • Input leakage current (IIH) should be kept below 10μA to ensure proper operation.
    • Output low voltage (VOL) should be between 0V and 0.5V.
    • Output high voltage (VOH) should be between 4.5V and 5.0V.
  5. Propagation Delay:

    • The propagation delay time (tpd) is typically 10ns, with a minimum of 5ns and a maximum of 15ns. This is important for timing-sensitive applications.
  6. Power Dissipation:

    • The device can dissipate up to 200mW. Ensure adequate heat dissipation if operating near the maximum power dissipation.
  7. Static Current:

    • The static current (ICC) is typically 10μA and should not exceed 20μA.
  8. Handling Precautions:

    • Handle the device with care to avoid static discharge. Use ESD protection measures.
    • Do not exceed the maximum ratings specified in the table to prevent damage to the device.
  9. Layout Considerations:

    • Place the device and associated components as close as possible to minimize trace lengths and reduce noise.
    • Use ground planes to improve signal integrity and reduce electromagnetic interference (EMI).
  10. Testing and Validation:

    • Before finalizing the design, test the device under various conditions to ensure it meets the required specifications and performance criteria.

For detailed application notes and further information, refer to the datasheet provided by the manufacturer.

(For reference only)

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