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M81735FP

Specifications

SKU: 5446928

BUY M81735FP https://www.utsource.net/itm/p/5446928.html
HIGH VOLTAGE HALF BRIDGE DRIVER
Parameter Symbol Min Typ Max Unit Notes
Supply Voltage Vcc 4.5 5.0 5.5 V
Operating Temperature Topr -40 85 °C
Storage Temperature Tstg -65 150 °C
Output Current (Sink) Ios 25 mA
Output Current (Source) Ios 25 mA
Input Leakage Current Ii -1 1 μA
Output Leakage Current Iol -10 10 μA
Propagation Delay Time tpd 10 20 30 ns
High-Level Output Voltage VoH 3.5 Vcc V
Low-Level Output Voltage VoL 0 0.4 V
High-Level Input Voltage VIH 3.5 Vcc V
Low-Level Input Voltage VIL 0 1.5 V

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the specified range of 4.5V to 5.5V.
    • Use a stable power source to avoid voltage fluctuations.
  2. Temperature Considerations:

    • The device operates reliably between -40°C and 85°C.
    • Store the device between -65°C and 150°C.
  3. Current Handling:

    • The output can sink or source up to 25mA.
    • Ensure that the load does not exceed this current limit to prevent damage.
  4. Leakage Current:

    • Input leakage current should be within ±1μA.
    • Output leakage current should be within ±10μA.
  5. Timing Parameters:

    • The propagation delay time (tpd) is typically 20ns but can range from 10ns to 30ns.
    • Account for this delay in your timing calculations.
  6. Voltage Levels:

    • Ensure that high-level output voltage (VoH) is at least 3.5V and can go up to Vcc.
    • Ensure that low-level output voltage (VoL) is between 0V and 0.4V.
    • High-level input voltage (VIH) should be at least 3.5V and can go up to Vcc.
    • Low-level input voltage (VIL) should be between 0V and 1.5V.
  7. Handling and Storage:

    • Handle the device with care to avoid static discharge.
    • Store the device in a dry, temperature-controlled environment to ensure long-term reliability.
  8. Mounting:

    • Follow standard surface mount technology (SMT) guidelines for mounting the device on a PCB.
    • Ensure proper soldering to maintain electrical connections and thermal performance.
  9. Testing:

    • Test the device under typical operating conditions to verify its functionality.
    • Use appropriate test equipment to measure parameters such as voltage levels and current handling.
  10. Compliance:

    • Ensure that the device meets all relevant safety and regulatory standards for your application.
(For reference only)

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