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Specifications
SKU: 5449456
Dual Inverter
| Parameter | Description | Value |
|---|---|---|
| Part Number | Component Identifier | NL27WZ04DTT1G |
| Type | Component Type | Logic IC |
| Function | Logic Function | Quad 2-Input NAND Gate |
| Package | Package Type | TSSOP-14 |
| Supply Voltage (Vcc) | Operating Supply Voltage Range | 1.65 V to 3.6 V |
| Operating Temperature Range | Temperature Range for Normal Operation | -40°C to 85°C |
| Output Current (Ioh) | Output High-Level Current | -8 mA (Min), -16 mA (Max) |
| Output Current (Iol) | Output Low-Level Current | 16 mA (Min), 32 mA (Max) |
| Propagation Delay Time (tpd) | Typical Propagation Delay Time at Vcc = 3.3V | 3.5 ns (Max) |
| Input Capacitance (Cin) | Input Capacitance | 4 pF (Max) |
| Output Capacitance (Cout) | Output Capacitance | 4 pF (Max) |
| Power Consumption (Pd) | Maximum Power Dissipation | 100 mW |
| Storage Temperature Range | Temperature Range for Storage | -65°C to 150°C |
Instructions:
Power Supply:
- Ensure that the supply voltage (Vcc) is within the specified range of 1.65 V to 3.6 V.
- Use appropriate decoupling capacitors (e.g., 0.1 μF ceramic capacitors) close to the power pins to minimize noise and ensure stable operation.
Input Signals:
- Apply input signals within the logic levels defined by the supply voltage.
- Ensure that input signals do not exceed the supply voltage or go below ground to avoid damage to the device.
Output Loads:
- Connect loads that can handle the maximum output current (Ioh and Iol) specified.
- If driving high-capacitive loads, consider using buffer circuits to reduce the load on the output pins.
Temperature Considerations:
- Operate the device within the specified operating temperature range (-40°C to 85°C).
- Store the device in a dry environment within the storage temperature range (-65°C to 150°C).
Handling Precautions:
- Handle the device with care to avoid electrostatic discharge (ESD) damage.
- Use proper ESD protection measures such as wrist straps and grounded work surfaces.
Soldering:
- Follow recommended soldering profiles to avoid thermal stress.
- Ensure that the soldering temperature does not exceed the maximum storage temperature of the device.
Testing:
- Test the device under typical operating conditions to verify its functionality.
- Use appropriate test equipment and procedures to avoid damaging the device during testing.
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