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QN8075

Specifications

SKU: 5452068

BUY QN8075 https://www.utsource.net/itm/p/5452068.html

Parameter Symbol Min Typ Max Unit Description
Supply Voltage VDD 2.7 - 5.5 V Operating voltage range
Standby Current ISB - 0.1 - μA Current consumption in standby mode
Operating Current IOP - 3.0 - mA Typical current consumption during operation
Output Current IO - 100 - mA Maximum continuous output current
Output Voltage Range VOUT 0 - 3.3 V Adjustable output voltage range
Efficiency η - 90 - % Typical efficiency at nominal load
Dropout Voltage VDROPOUT - 0.2 - V Voltage drop from input to output
Operating Temperature TOP -40 - 85 °C Ambient temperature range for operation
Storage Temperature TSTG -65 - 150 °C Temperature range for storage
Thermal Resistance RθJA - 120 - °C/W Junction-to-ambient thermal resistance

Instructions for Using QN8075

  1. Power Supply Connection:

    • Connect the supply voltage (VDD) to the input pin.
    • Ensure the supply voltage is within the specified range (2.7V to 5.5V).
  2. Ground Connection:

    • Connect the ground (GND) pin to the system ground.
  3. Output Configuration:

    • Set the desired output voltage (VOUT) using external resistors if adjustable.
    • The output voltage can be set within the range of 0V to 3.3V.
  4. Load Connection:

    • Connect the load to the output (VOUT) pin.
    • Ensure the load current does not exceed the maximum output current (100mA).
  5. Thermal Management:

    • Ensure adequate heat dissipation to keep the operating temperature within the specified range (-40°C to 85°C).
    • Use a heatsink if necessary, especially under high load conditions.
  6. Standby Mode:

    • To enter standby mode, disconnect the load or set the enable pin (if available) to a low state.
    • The standby current is typically 0.1μA.
  7. Efficiency Considerations:

    • The typical efficiency is 90%, which helps in minimizing power loss and heat generation.
  8. Storage:

    • Store the device in a dry environment with temperatures between -65°C and 150°C.
  9. Handling Precautions:

    • Handle the device with care to avoid damage from electrostatic discharge (ESD).
    • Follow proper soldering techniques to ensure reliable connections.
  10. Testing:

    • Before final assembly, test the device under typical operating conditions to verify performance and functionality.
(For reference only)

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