Instructions for Use:

1. Handling Precautions:

   • Handle the device with care to avoid damage to the pins and body.
   • Use appropriate ESD (Electrostatic Discharge) protection measures to prevent damage from static electricity.

2. Mounting:

   • Ensure proper alignment of the device during mounting to avoid mechanical stress on the pins.
   • Use thermal paste or a thermal pad between the device and the heatsink to improve heat dissipation.

3. Thermal Management:

   • The device has a maximum power dissipation of 360W at T_C = 25°C. Ensure adequate cooling to maintain the junction temperature below 175°C.
   • Use a heatsink with sufficient surface area and thermal conductivity to manage heat effectively.

4. Electrical Connections:

   • Connect the gate to the control circuit with short leads to minimize parasitic inductance.
   • Ensure that the gate resistor is appropriately sized to limit gate current and protect the device from overvoltage.

5. Operating Conditions:

   • Do not exceed the maximum ratings specified in the table.
   • Operate the device within the recommended operating conditions to ensure reliable performance and longevity.

6. Testing:

   • Before final assembly, test the device under controlled conditions to verify its functionality and performance.
   • Use appropriate test equipment and follow safety guidelines to avoid damage to the device or injury.

7. Storage:

   • Store the device in a dry, cool place away from direct sunlight and sources of heat.
   • Keep the device in its original packaging until ready for use to protect it from environmental factors.