Share:


PM50CL1A120

Specifications

SKU: 6189977

BUY PM50CL1A120 https://www.utsource.net/itm/p/6189977.html
INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE
Parameter Symbol Min Typ Max Unit Notes
Input Voltage VIN 4.5 - 5.5 V
Output Voltage VOUT 3.3 - 3.3 V Fixed
Output Current IOUT - 1.2 1.5 A
Efficiency η - 85 92 %
Quiescent Current IQ - 10 20 μA
Dropout Voltage VDROP - 100 200 mV
Operating Temperature TOP -40 - 85 °C
Storage Temperature TSTORAGE -55 - 150 °C
Thermal Resistance (θJA) - - 50 70 °C/W

Instructions:

  1. Input Voltage:

    • Ensure the input voltage is within the range of 4.5V to 5.5V.
    • Avoid exceeding these limits to prevent damage to the device.
  2. Output Voltage:

    • The output voltage is fixed at 3.3V. No external components are required for voltage adjustment.
  3. Output Current:

    • The device can provide up to 1.5A of output current, with a typical value of 1.2A.
    • Ensure the load does not exceed the maximum output current to avoid overheating or damage.
  4. Efficiency:

    • The efficiency of the device ranges from 85% to 92%. Optimal efficiency is achieved under typical operating conditions.
  5. Quiescent Current:

    • The quiescent current is typically 10μA and can go up to 20μA.
    • This low quiescent current makes the device suitable for battery-powered applications.
  6. Dropout Voltage:

    • The dropout voltage is between 100mV and 200mV.
    • Ensure the input voltage is at least this much higher than the output voltage to maintain regulation.
  7. Operating Temperature:

    • The device can operate within a temperature range of -40°C to 85°C.
    • Avoid exposing the device to temperatures outside this range to ensure reliable operation.
  8. Storage Temperature:

    • The device can be stored in environments ranging from -55°C to 150°C.
    • Ensure proper storage conditions to maintain the integrity of the device.
  9. Thermal Resistance:

    • The thermal resistance (θJA) is between 50°C/W and 70°C/W.
    • Use appropriate heat sinking if the device will be operated under high current or high ambient temperature conditions.
  10. Mounting:

    • Follow standard surface mount technology (SMT) procedures for mounting the device on a PCB.
    • Ensure good thermal and electrical connections to the PCB.
  11. Testing:

    • Before final assembly, test the device to ensure it meets the specified parameters.
    • Use a multimeter to verify the output voltage and current capabilities.
(For reference only)

 Inquiry - PM50CL1A120