Specifications
SKU: 6189977
INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE
Parameter | Symbol | Min | Typ | Max | Unit | Notes |
---|---|---|---|---|---|---|
Input Voltage | VIN | 4.5 | - | 5.5 | V | |
Output Voltage | VOUT | 3.3 | - | 3.3 | V | Fixed |
Output Current | IOUT | - | 1.2 | 1.5 | A | |
Efficiency | η | - | 85 | 92 | % | |
Quiescent Current | IQ | - | 10 | 20 | μA | |
Dropout Voltage | VDROP | - | 100 | 200 | mV | |
Operating Temperature | TOP | -40 | - | 85 | °C | |
Storage Temperature | TSTORAGE | -55 | - | 150 | °C | |
Thermal Resistance (θJA) | - | - | 50 | 70 | °C/W |
Instructions:
Input Voltage:
- Ensure the input voltage is within the range of 4.5V to 5.5V.
- Avoid exceeding these limits to prevent damage to the device.
Output Voltage:
- The output voltage is fixed at 3.3V. No external components are required for voltage adjustment.
Output Current:
- The device can provide up to 1.5A of output current, with a typical value of 1.2A.
- Ensure the load does not exceed the maximum output current to avoid overheating or damage.
Efficiency:
- The efficiency of the device ranges from 85% to 92%. Optimal efficiency is achieved under typical operating conditions.
Quiescent Current:
- The quiescent current is typically 10μA and can go up to 20μA.
- This low quiescent current makes the device suitable for battery-powered applications.
Dropout Voltage:
- The dropout voltage is between 100mV and 200mV.
- Ensure the input voltage is at least this much higher than the output voltage to maintain regulation.
Operating Temperature:
- The device can operate within a temperature range of -40°C to 85°C.
- Avoid exposing the device to temperatures outside this range to ensure reliable operation.
Storage Temperature:
- The device can be stored in environments ranging from -55°C to 150°C.
- Ensure proper storage conditions to maintain the integrity of the device.
Thermal Resistance:
- The thermal resistance (θJA) is between 50°C/W and 70°C/W.
- Use appropriate heat sinking if the device will be operated under high current or high ambient temperature conditions.
Mounting:
- Follow standard surface mount technology (SMT) procedures for mounting the device on a PCB.
- Ensure good thermal and electrical connections to the PCB.
Testing:
- Before final assembly, test the device to ensure it meets the specified parameters.
- Use a multimeter to verify the output voltage and current capabilities.
Inquiry - PM50CL1A120